SGLS178I August   2003  – November 2024 LM2902-Q1 , LM2902B-Q1 , LM2902BA-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configurations and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics - LM2902B-Q1 and LM2902BA-Q1
    6. 5.6 Electrical Characteristics: LM2902-Q1, LM2902KV-Q1, LM2902KAV-Q1
    7. 5.7 Operating Conditions: LM2902-Q1, LM2902KV-Q1, LM2902KAV-Q1
    8. 5.8 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Input Common-Mode Range
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

5.4 Thermal Information

THERMAL METRIC(1) LM2902-Q1, LM2902KV-Q1, LM2902KAV-Q1 LM2902B-Q1, LM2902BA-Q1 UNIT
D (SOIC) PW (TSSOP) D (SOIC) PW (TSSOP)
14 PINS 14 PINS 14 PINS 14 PINS
RθJA Junction-to-ambient thermal resistance 101 86 99.3 133.3 °C/W
RθJC Junction-to-case (top) thermal resistance — — 60.4 63.4 °C/W
RθJB Junction-to-board thermal resistance — — 57.5 76.5 °C/W
ψJT Junction-to-top characterization parameter — — 19.8 15.6 °C/W
ψJB Junction-to-board characterization parameter — — 57.0 75.9 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application note.