SGLS307Q July   2006  – August 2024 TLK2711-SP

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 TTL Input Electrical Characteristics
    6. 5.6 Transmitter/Receiver Electrical Characteristics
    7. 5.7 Reference Clock (TXCLK) Timing Requirements
    8. 5.8 TTL Output Switching Characteristics
    9. 5.9 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Transmit Interface
      2. 6.3.2  Transmit Data Bus
      3. 6.3.3  Data Transmission Latency
      4. 6.3.4  8-Bit/10-Bit Encoder
      5. 6.3.5  Pseudo-Random Bit Stream (PRBS) Generator
      6. 6.3.6  Parallel to Serial
      7. 6.3.7  High-Speed Data Output
      8. 6.3.8  Receive Interface
      9. 6.3.9  Receive Data Bus
      10. 6.3.10 Data Reception Latency
      11. 6.3.11 Serial to Parallel
      12. 6.3.12 Comma Detect and 8-Bit/10-Bit Decoding
      13. 6.3.13 LOS Detection
      14. 6.3.14 PRBS Verification
      15. 6.3.15 Reference Clock Input
      16. 6.3.16 Operating Frequency Range
      17. 6.3.17 Testability
      18. 6.3.18 Loopback Testing
      19. 6.3.19 BIST
      20. 6.3.20 Power-On Reset
    4. 6.4 Device Functional Modes
      1. 6.4.1 Power-Down Mode
      2. 6.4.2 High-Speed I/O Directly-Coupled Mode
      3. 6.4.3 High-Speed I/O AC-Coupled Mode
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

8.4 Electrostatic Discharge Caution

TLK2711-SP This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.