SLAA996A June   2021  – June 2021 TPA6304-Q1

 

  1.   Trademarks
  2. 1Introduction
  3. 2Understanding the Thermal Flow
  4. 3Understanding the Test and System Conditions
    1. 3.1 Device Efficiency
    2. 3.2 Test Signals
      1. 3.2.1 Sinusoidal Signal
      2. 3.2.2 Pink Noise
      3. 3.2.3 Music File
    3. 3.3 Ambient Temperature
    4. 3.4 Junction Temperature
    5. 3.5 Thermal Interface Material and Heatsink
  5. 4Calculating Dynamic Thermal Dissipation
  6. 5Designing a Realistic Thermal Test
  7. 6Thermal Tests
    1. 6.1 Test Setup
    2. 6.2 5W 1kHz Sine Wave Test
      1. 6.2.1 Calculations
      2. 6.2.2 Dynamic Calculation Results
      3. 6.2.3 Tested Results
      4. 6.2.4 Summary of Results
    3. 6.3 10W 1kHz Sine Wave Test
      1. 6.3.1 Calculations
      2. 6.3.2 Dynamic Calculation Results
      3. 6.3.3 Tested Results
      4. 6.3.4 Summary of Results
    4. 6.4 5W Pink Noise Test
      1. 6.4.1 Calculations
      2. 6.4.2 Dynamic Calculation Results
      3. 6.4.3 Tested Results
      4. 6.4.4 Summary of Results
    5. 6.5 10W 1kHz 85°C Test
      1. 6.5.1 Calculations
      2. 6.5.2 Dynamic Calculation Results
      3. 6.5.3 Tested Results
      4. 6.5.4 Summary of Results
  8. 7Overall Summary
  9. 8References
  10. 9Revision History

Dynamic Calculation Results

The TPA6304-Q1 Thermal Design is used to calculate the dynamic thermal performance of the system.

GUID-20210401-CA0I-3D3Z-9D7T-H0P8XC5RGBF7-low.pngFigure 6-9 Dynamic Calculation Table
GUID-20210401-CA0I-QNH5-2MLQ-RTSQKCZSMNPX-low.pngFigure 6-10 Dynamic Calculation Results: 10W 1kHz Sine Wave Temperature Over Time

Temperatures at thermal equilibrium:

  • Junction Temperature = 100.8°C
  • Case Temperature = 95.5°C
  • Heatsink Temperature = 93.7°C