SLAAEM7 September   2024 TAS2120 , TAS2320

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Introduction
  5. 2Application Schematics
    1. 2.1 Recommended Component Ratings
    2. 2.2 Reference Schematic
  6. 3Design Guidelines
    1. 3.1  VDD Pin
    2. 3.2  PVDD Pin
    3. 3.3  GREG Pin
    4. 3.4  SW Pin
    5. 3.5  VBAT Pin
    6. 3.6  OUT_P and OUT_N Pins
      1. 3.6.1 Optional EMI Filter on Output
    7. 3.7  IOVDD Pin
    8. 3.8  DREG Pin
    9. 3.9  Digital I/O Pins
    10. 3.10 Ground Pins
    11. 3.11 HW Selection Pins
  7. 4EMI Specific Guidelines
  8. 5Summary
  9. 6References

GREG Pin

The GREG pin acts as the supply pin for the high-side gate drivers in the boost converter and the Class-D output stages. The GREG pin is powered using the voltage on the VBAT pin.

The following recommendations need to be taken into account when routing the GREG pin on to the PCB:

  • The GREG pin needs to be decoupled to the PVDD pin using a capacitor of value 0.1µF (recommendation is to use a 0201 package to minimize ESL and ESR).
  • The top plate needs to be connected to the GREG pin, and the bottom plate needs to use a star-connection directly to the PVDD pins, and not to the PVDD PCB plane or the top plate of the PVDD decoupling capacitor, to avoid common inductance to the PVDD pins.
  • The voltage rating of the decoupling capacitor must be ≥ 6.3V.
  • If the connection is made in inner PCB layers, use multiple vias to reduce parasitic inductance in the path.
 Incorrect Routing of GREG Decoupling CapacitorFigure 3-5 Incorrect Routing of GREG Decoupling Capacitor
 Correct Routing of GREG Decoupling CapacitorFigure 3-6 Correct Routing of GREG Decoupling Capacitor
 Placement of GREG Decoupling Capacitor on EVMFigure 3-7 Placement of GREG Decoupling Capacitor on EVM
 Connection of GREG Decoupling Capacitor to Inner Layer Using ViasFigure 3-8 Connection of GREG Decoupling Capacitor to Inner Layer Using Vias