SLAAEM7 September   2024 TAS2120 , TAS2320

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Introduction
  5. 2Application Schematics
    1. 2.1 Recommended Component Ratings
    2. 2.2 Reference Schematic
  6. 3Design Guidelines
    1. 3.1  VDD Pin
    2. 3.2  PVDD Pin
    3. 3.3  GREG Pin
    4. 3.4  SW Pin
    5. 3.5  VBAT Pin
    6. 3.6  OUT_P and OUT_N Pins
      1. 3.6.1 Optional EMI Filter on Output
    7. 3.7  IOVDD Pin
    8. 3.8  DREG Pin
    9. 3.9  Digital I/O Pins
    10. 3.10 Ground Pins
    11. 3.11 HW Selection Pins
  7. 4EMI Specific Guidelines
  8. 5Summary
  9. 6References

OUT_P and OUT_N Pins

The OUT_P and OUT_N pins correspond to the differential output of the Class-D amplifier. The following guidelines need to be taken into account for routing these pins on the PCB:

  • These pins switch from 0 - AVDD in Y-bridge mode, and 0 - PVDD when Y-bridge threshold is exceeded.
  • This switching happens at fast edge rates, and results in high switching current at these nodes. Therefore these pins need to be routed to the speaker with wide traces capable of carrying high current.
  • When the routing switches into inner layers of the PCB, multiple vias need to be used to provide current carrying capacity, and reduced parasitic inductance.
  • The parasitic capacitance on these pins need to be kept to a minimum, since these parasitic capacitance results in increased switching losses, impacting efficiency. If the capacitance is high enough, the switching can also potentially trigger over-current interrupts.
  • Since these nodes are high-voltage switching nodes, avoid routing any low-voltage nodes across this path, like BCLK, FSYNC, SDIN, SDOUT, and more, to avoid coupling.
 Routing of OUT_P/N to Speaker TerminalsFigure 3-13 Routing of OUT_P/N to Speaker Terminals
 Routing Below OUT_P/N Paths in Inner PCB LayersFigure 3-14 Routing Below OUT_P/N Paths in Inner PCB Layers