3 Description

The Texas Instruments MSP430FR604x and MSP430FR603x family of ultrasonic sensing and measurement SoCs are powerful, highly integrated microcontrollers (MCUs) that are optimized for water and heat meters. The MSP430FR604x MCUs offer an integrated ultrasonic sensing solution (USS) module, which provides high accuracy for a wide range of flow rates. The USS module helps achieve ultra-low-power metering combined with lower system cost due to maximum integration requiring very few external components. MSP430FR604x and MSP430FR603x MCUs implement a high-speed ADC-based signal acquisition followed by optimized digital signal processing using the integrated low-energy accelerator (LEA) module to deliver a high-accuracy metering solution with ultra-low power optimum for battery-powered metering applications.

The USS module includes a programmable pulse generator (PPG) and a physical interface (PHY) with a low-impedance output driver for optimum sensor excitation and accurate impendence matching to deliver best results for zero-flow drift (ZFD). The module also includes a programmable gain amplifier (PGA) and a high-speed 12-bit 8-Msps sigma-delta ADC (SDHS) for accurate signal acquisition from industry-standard ultrasonic transducers.

Additionally, MSP430FR604x and MSP430FR603x MCUs integrate other peripherals to improve system integration for metering. The devices have a metering test interface (MTIF) module to implement pulse generation to indicate flow measured by the meter. The MSP430FR604x and MSP430FR603x MCUs also have an on-chip 8-mux LCD driver, an RTC, a 12-bit SAR ADC, an analog comparator, an advanced encryption accelerator (AES256), and a cyclic redundancy check (CRC) module.

MSP430FR604x and MSP430FR603x MCUs are supported by an extensive hardware and software ecosystem with reference designs and code examples to get your design started quickly. Development kits include the MSP‑TS430PZ100E 100-pin target development board and EVM430‑FR6047 ultrasonic water flow meter EVM. TI also provides free software including the ultrasonic sensing design center, ultrasonic sensing software library, and MSP430Ware™ software.

TI's MSP430 ultra-low-power (ULP) FRAM microcontroller platform combines uniquely embedded FRAM and a holistic ultra-low-power system architecture, letting system designers increase performance while lowering energy consumption. FRAM technology combines the low-energy fast writes, flexibility, and endurance of RAM with the nonvolatility of flash.

For complete module descriptions, see the MSP430FR58xx, MSP430FR59xx, and MSP430FR6xx Family User's Guide.

Device Information⁽¹⁾⁽²⁾

PART NUMBER	PACKAGE	BODY SIZE⁽³⁾
MSP430FR6047IPZ MSP430FR60471IPZ MSP430FR6045IPZ MSP430FR6037IPZ MSP430FR60371IPZ MSP430FR6035IPZ	LQFP (100)	14 mm × 14 mm

(1) For the most current part, package, and ordering information for all available devices, see the Package Option Addendum in Section 12, or see the TI website at www.ti.com.

(2) For a comparison of all available device variants, see Section 6.

(3) The sizes shown here are approximations. For the package dimensions with tolerances, see the Mechanical Data in Section 12.