SLASEO5D March   2019  – September 2021 MSP430FR2672 , MSP430FR2673 , MSP430FR2675 , MSP430FR2676

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Functional Block Diagram
  5. 5 Revision History
  6. 6 Device Comparison
    1. 6.1 Related Products
  7. 7 Terminal Configuration and Functions
    1. 7.1 Pin Diagrams
    2. 7.2 Pin Attributes
    3. 7.3 Signal Descriptions
    4. 7.4 Pin Multiplexing
    5. 7.5 Buffer Types
    6. 7.6 Connection of Unused Pins
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Active Mode Supply Current Into VCC Excluding External Current
    5. 8.5  Active Mode Supply Current Per MHz
    6. 8.6  Low-Power Mode LPM0 Supply Currents Into VCC Excluding External Current
    7. 8.7  Low-Power Mode (LPM3, LPM4) Supply Currents (Into VCC) Excluding External Current
    8. 8.8  Low-Power Mode LPMx.5 Supply Currents (Into VCC) Excluding External Current
    9. 8.9  Typical Characteristics – Low-Power Mode Supply Currents
    10. 8.10 Current Consumption Per Module
    11. 8.11 Thermal Resistance Characteristics
    12. 8.12 Timing and Switching Characteristics
      1. 8.12.1  Power Supply Sequencing
        1. 8.12.1.1 PMM, SVS and BOR
      2. 8.12.2  Reset Timing
        1. 8.12.2.1 Wake-up Times From Low-Power Modes and Reset
      3. 8.12.3  Clock Specifications
        1. 8.12.3.1 XT1 Crystal Oscillator (Low Frequency)
        2. 8.12.3.2 DCO FLL, Frequency
        3. 8.12.3.3 DCO Frequency
        4. 8.12.3.4 REFO
        5. 8.12.3.5 Internal Very-Low-Power Low-Frequency Oscillator (VLO)
        6. 8.12.3.6 Module Oscillator (MODOSC)
      4. 8.12.4  Digital I/Os
        1. 8.12.4.1 Digital Inputs
        2. 8.12.4.2 Digital Outputs
        3. 8.12.4.3 Typical Characteristics – Outputs at 3 V and 2 V
      5. 8.12.5  Internal Shared Reference
        1. 8.12.5.1 Internal Reference Characteristics
      6. 8.12.6  Timer_A and Timer_B
        1. 8.12.6.1 Timer_A
        2. 8.12.6.2 Timer_B
      7. 8.12.7  eUSCI
        1. 8.12.7.1 eUSCI (UART Mode) Clock Frequency
        2. 8.12.7.2 eUSCI (UART Mode) Timing Characteristics
        3. 8.12.7.3 eUSCI (SPI Master Mode) Clock Frequency
        4. 8.12.7.4 eUSCI (SPI Master Mode)
        5. 8.12.7.5 eUSCI (SPI Slave Mode)
        6. 8.12.7.6 eUSCI (I2C Mode)
      8. 8.12.8  ADC
        1. 8.12.8.1 ADC, Power Supply and Input Range Conditions
        2. 8.12.8.2 ADC, Timing Parameters
        3. 8.12.8.3 ADC, Linearity Parameters
      9. 8.12.9  Enhanced Comparator (eCOMP)
        1. 8.12.9.1 eCOMP0 Characteristics
      10. 8.12.10 CapTIvate
        1. 8.12.10.1 CapTIvate Electrical Characteristics
        2. 8.12.10.2 CapTIvate Signal-to-Noise Ratio Characteristics
      11. 8.12.11 FRAM
        1. 8.12.11.1 FRAM Characteristics
      12. 8.12.12 Debug and Emulation
        1. 8.12.12.1 JTAG, 4-Wire and Spy-Bi-Wire Interface
  9. 9 Detailed Description
    1. 9.1  Overview
    2. 9.2  CPU
    3. 9.3  Operating Modes
    4. 9.4  Interrupt Vector Addresses
    5. 9.5  Bootloader (BSL)
    6. 9.6  JTAG Standard Interface
    7. 9.7  Spy-Bi-Wire Interface (SBW)
    8. 9.8  FRAM
    9. 9.9  Memory Protection
    10. 9.10 Peripherals
      1. 9.10.1  Power-Management Module (PMM)
      2. 9.10.2  Clock System (CS) and Clock Distribution
      3. 9.10.3  General-Purpose Input/Output Port (I/O)
      4. 9.10.4  Watchdog Timer (WDT)
      5. 9.10.5  System (SYS) Module
      6. 9.10.6  Cyclic Redundancy Check (CRC)
      7. 9.10.7  Enhanced Universal Serial Communication Interface (eUSCI_A0, eUSCI_B0)
      8. 9.10.8  Timers (TA0, TA1, TA2, TA3 and TB0)
      9. 9.10.9  Hardware Multiplier (MPY)
      10. 9.10.10 Backup Memory (BAKMEM)
      11. 9.10.11 Real-Time Clock (RTC)
      12. 9.10.12 12-Bit Analog-to-Digital Converter (ADC)
      13. 9.10.13 eCOMP0
      14. 9.10.14 CapTIvate Technology
      15. 9.10.15 Embedded Emulation Module (EEM)
    11. 9.11 Input/Output Diagrams
      1. 9.11.1 Port P1 (P1.0 to P1.7) Input/Output With Schmitt Trigger
      2. 9.11.2 Port P2 (P2.0 to P2.7) Input/Output With Schmitt Trigger
      3. 9.11.3 Port P3 (P3.0 to P3.7) Input/Output With Schmitt Trigger
      4. 9.11.4 Port P4 (P4.0 to P4.7) Input/Output With Schmitt Trigger
      5. 9.11.5 Port P5 (P5.0 to P5.7) Input/Output With Schmitt Trigger
      6. 9.11.6 Port P6 (P6.0 to P6.2) Input/Output With Schmitt Trigger
    12. 9.12 Device Descriptors
    13. 9.13 Memory
      1. 9.13.1 Memory Organization
      2. 9.13.2 Peripheral File Map
    14. 9.14 Identification
      1. 9.14.1 Revision Identification
      2. 9.14.2 Device Identification
      3. 9.14.3 JTAG Identification
  10. 10Applications, Implementation, and Layout
    1. 10.1 Device Connection and Layout Fundamentals
      1. 10.1.1 Power Supply Decoupling and Bulk Capacitors
      2. 10.1.2 External Oscillator
      3. 10.1.3 JTAG
      4. 10.1.4 Reset
      5. 10.1.5 Unused Pins
      6. 10.1.6 General Layout Recommendations
      7. 10.1.7 Do's and Don'ts
    2. 10.2 Peripheral- and Interface-Specific Design Information
      1. 10.2.1 ADC Peripheral
        1. 10.2.1.1 Partial Schematic
        2. 10.2.1.2 Design Requirements
        3. 10.2.1.3 Layout Guidelines
      2. 10.2.2 CapTIvate Peripheral
        1. 10.2.2.1 Device Connection and Layout Fundamentals
        2. 10.2.2.2 125
        3. 10.2.2.3 Measurements
          1. 10.2.2.3.1 SNR
          2. 10.2.2.3.2 Sensitivity
          3. 10.2.2.3.3 Power
    3. 10.3 CapTIvate Technology Evaluation
  11. 11Device and Documentation Support
    1. 11.1 Getting Started and Next Steps
    2. 11.2 Device Nomenclature
    3. 11.3 Tools and Software
    4. 11.4 Documentation Support
    5. 11.5 Support Resources
    6. 11.6 Trademarks
    7. 11.7 Electrostatic Discharge Caution
    8. 11.8 Export Control Notice
    9. 11.9 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

9.12 Device Descriptors

Table 9-29 lists the Device IDs. Table 9-30 lists the contents of the device descriptor tag-length-value (TLV) structure.

Table 9-29 Device IDs
DEVICEDEVICE ID
1A05h1A04h
MSP430FR267683h28h
MSP430FR267583h29h
MSP430FR267383h38h
MSP430FR267283h39h
Table 9-30 Device Descriptors
DESCRIPTIONADDRESSVALUE
Information blockInfo length1A00h06h
CRC length1A01h06h
CRC value(1)1A02hPer unit
1A03hPer unit
Device ID1A04hSee Table 9-29
1A05h
Hardware revision1A06hPer unit
Firmware revision1A07hPer unit
Die recordDie record tag1A08h08h
Die record length1A09h0Ah
Lot wafer ID1A0AhPer unit
1A0BhPer unit
1A0ChPer unit
1A0DhPer unit
Die X position1A0EhPer unit
1A0FhPer unit
Die Y position1A10hPer unit
1A11hPer unit
Test result1A12hPer unit
1A13hPer unit
ADC calibrationADC calibration tag1A14h11h
ADC calibration length1A15h10h
ADC gain factor(3)1A16hPer unit
1A17hPer unit
ADC offset(4)1A18hPer unit
1A19hPer unit
ADC internal shared 1.5-V reference, temperature sensor 30°C1A1AhPer unit
1A1BhPer unit
ADC internal shared 1.5-V reference, temperature sensor 105°C1A1ChPer unit
1A1DhPer unit
ADC internal shared 2.0-V reference, temperature sensor 30°C1A1EhPer unit
1A1FhPer unit
ADC internal shared 2.0-V reference, temperature sensor 105°C1A20hPer unit
1A21hPer unit
ADC internal shared 2.5-V reference, temperature sensor 30°C1A22hPer unit
1A23hPer unit
ADC internal shared 2.5-V reference, temperature sensor 105°C1A24hPer unit
1A25hPer unit
Reference and DCO calibrationInternal shared reference Calibration tag1A26h12h
Internal shared reference Calibration length1A27h0Ah
Internal shared 1.5-V reference factor1A28hPer unit
1A29hPer unit
Internal shared 2.0-V reference factor1A2AhPer unit
1A2BhPer unit
Internal shared 2.5-V reference factor1A2ChPer unit
1A2DhPer unit
DCO tap settings for 16 MHz, temperature 30°C1A2EhPer unit
1A2FhPer unit
DCO tap settings for 24 MHz, temperature 30°C (2)1A30hPer unit
1A31hPer unit
(1) CRC value covers the checksum from 0x1A04h to 0x1AF7h by applying CRC-CCITT-16 polynomial of x16 + x12 + x5 + 1.
(2) This value can be directly loaded into the DCO bits in the CSCTL0 register to get an accurate 24-MHz frequency at room temperature, especially when MCU exits from LPM3 and below. TI also suggests to use a predivider to decrease the frequency if the temperature drift might result an overshoot faster than 24 MHz.
(3) ADC gain: the gain correction factor is measured at 2.4 V and room temperature using ADCSREFx = 0x7, an external reference without internal buffer. VR+= Veref+, VR-= Veref-. Other settings can result in different factors.
(4) ADC offset: the offset correction factor is measured at 2.4 V and room temperature using ADCSREFx = 0x7, an external reference without internal buffer. VR+= Veref+, VR-= Veref-. Other settings can result in different factors