SLASEQ6A
Septmeber 2018 – June 2019
HD3SS3212-Q1
PRODUCTION DATA.
1
Features
2
Applications
3
Description
Device Images
Simplified Schematic
4
Revision History
5
Pin Configuration and Functions
Pin Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics
6.6
High-Speed Performance Parameters
6.7
Switching Characteristics
7
Parameter Measurement Information
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagram
8.3
Feature Description
8.3.1
Output Enable and Power Savings
8.4
Device Functional Modes
9
Application and Implementation
9.1
Application Information
9.2
Typical Applications
9.2.1
Down Facing Port for USB3.1 Type C
9.2.1.1
Design Requirements
9.2.1.2
Detailed Design Procedure
9.2.1.3
Application Curves
9.3
Systems Examples
9.3.1
Up Facing Port for USB 3.2 Type C
9.3.2
PCIe/SATA/USB
9.3.3
PCIE/eSATA
9.3.4
USB/eSATA
10
Power Supply Recommendations
11
Layout
11.1
Layout Guidelines
11.2
Layout Example
12
Device and Documentation Support
12.1
Receiving Notification of Documentation Updates
12.2
Community Resources
12.3
Trademarks
12.4
Electrostatic Discharge Caution
12.5
Glossary
13
Mechanical, Packaging, and Orderable Information
1
Features
AEC-Q100 Qualified for automotive applications
Temperature grade 2: –40°C to +105°C, T
A
Provides MUX/DEMUX solution for USB Type-C™ ecosystem for USB
3.2
Gen 1 and Gen 2 data rates
Compatible with MIPI DSI/CSI, FPD-Link III, LVDS, and PCIe Gen II, III
Operates up to 10 Gbps
Wide –3-dB Differential BW of over 8 GHz
Excellent dynamic characteristics (at 5 GHz)
Crosstalk = –28 dB
Off isolation = –19 dB
Insertion loss = –2 dB
Return loss = –8 dB
Bidirectional "Mux/De-Mux" differential switch
Supports common mode voltage 0 V to 2 V
Single supply voltage V
CC
of 3.3 V
Available in automotive friendly QFN package
(2.5 mm x 4.5 mm at 0.5 mm pitch)