SLASEQ6A Septmeber   2018  – June 2019 HD3SS3212-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 High-Speed Performance Parameters
    7. 6.7 Switching Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Output Enable and Power Savings
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Down Facing Port for USB3.1 Type C
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
    3. 9.3 Systems Examples
      1. 9.3.1 Up Facing Port for USB 3.2 Type C
      2. 9.3.2 PCIe/SATA/USB
      3. 9.3.3 PCIE/eSATA
      4. 9.3.4 USB/eSATA
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) HD3SS3212-Q1 UNIT
RKS (VQFN)
20 PINS
RθJA Junction-to-ambient thermal resistance 58.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 59.9 °C/W
RθJB Junction-to-board thermal resistance 32.1 °C/W
ψJT Junction-to-top characterization parameter 5.9 °C/W
ψJB Junction-to-board characterization parameter 32 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 16.7 °C/W
(1) For more information about traditional and new thermalmetrics, see the Semiconductor and IC Package ThermalMetrics application report.