SLASF03 December   2021 DAC11001B

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Timing Requirements: Write, 4.5 V ≤ DVDD ≤ 5.5 V
    7. 6.7  Timing Requirements: Write, 2.7 V ≤ DVDD < 4.5 V
    8. 6.8  Timing Requirements: Read and Daisy-Chain Write, 4.5 V ≤ DVDD ≤ 5.5 V
    9. 6.9  Timing Requirements: Read and Daisy-Chain Write, 2.7 V ≤ DVDD < 4.5 V
    10. 6.10 Timing Diagrams
    11. 6.11 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Digital-to-Analog Converter Architecture
      2. 7.3.2 External Reference
      3. 7.3.3 Output Buffers
      4. 7.3.4 Internal Power-On Reset (POR)
      5. 7.3.5 Temperature Drift and Calibration
      6. 7.3.6 DAC Output Deglitch Circuit
    4. 7.4 Device Functional Modes
      1. 7.4.1 Fast-Settling Mode and THD
      2. 7.4.2 DAC Update Rate Mode
    5. 7.5 Programming
      1. 7.5.1 Daisy-Chain Operation
      2. 7.5.2 CLR Pin Functionality and Software Clear
      3. 7.5.3 Output Update (Synchronous and Asynchronous)
        1. 7.5.3.1 Synchronous Update
        2. 7.5.3.2 Asynchronous Update
      4. 7.5.4 Software Reset Mode
    6. 7.6 Register Map
      1. 7.6.1 NOP Register (address = 00h) [reset = 0x000000h for bits [23:0]]
      2. 7.6.2 DAC-DATA Register (address = 01h) [reset = 0x000000h for bits [23:0]]
      3. 7.6.3 CONFIG1 Register (address = 02h) [reset = 004C80h for bits [23:0]]
      4. 7.6.4 DAC-CLEAR-DATA Register (address = 03h) [reset = 000000h for bits [23:0]]
      5. 7.6.5 TRIGGER Register (address = 04h) [reset = 000000h for bits [23:0]]
      6. 7.6.6 STATUS Register (address = 05h) [reset = 000000h for bits [23:0]]
      7. 7.6.7 CONFIG2 Register (address = 06h) [reset = 000040h for bits [23:0]]
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Source Measure Unit (SMU)
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 High-Precision Control Loop
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curves
      3. 8.2.3 Arbitrary Waveform Generation (AWG)
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Detailed Design Procedure
        3. 8.2.3.3 Application Curves
    3. 8.3 System Examples
      1. 8.3.1 Interfacing to a Processor
      2. 8.3.2 Interfacing to a Low-Jitter LDAC Source
      3. 8.3.3 Embedded Resistor Configurations
        1. 8.3.3.1 Minimizing Bias Current Mismatch
        2. 8.3.3.2 2x Gain Configuration
        3. 8.3.3.3 Generating Negative Reference
    4. 8.4 What to Do and What Not to Do
      1. 8.4.1 What to Do
      2. 8.4.2 What Not to Do
    5. 8.5 Initialization Set Up
  9. 9 Power Supply Recommendations
    1. 9.1 Power-Supply Sequencing
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 PCB Assembly Effects on Precision
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

10.1 Layout Guidelines

PCB layout plays a significant role for achieving desired ac and dc performance from the DAC11001B. The DAC11001B has a pinout that supports easy splitting of the noisy and quiet grounds. The digital signals are available on two adjacent sides of the device; whereas, the power and analog signals are available separate sides. Figure 10-4 shows an example layout, where the different ground planes have been clearly demarcated. The figure also shows the best positions for the single-point shorts between the ground planes. For best power-supply bypassing, place the bypass capacitors close to the respective power pins as shown. Provide unbroken ground reference planes for the digital signal traces, especially for the SPI and LDAC signals.