SLASF88B October   2023  – May 2024 MSPM0G3505-Q1 , MSPM0G3506-Q1 , MSPM0G3507-Q1

PRODUCTION DATA  

1.   1
2. 1 Features
3. 2 Applications
4. 3 Description
5. 4 Functional Block Diagram
6. 5 Device Comparison
7. 6 Pin Configuration and Functions
   1. 6.1 Pin Diagrams
   2. 6.2 Pin Attributes
   3. 6.3 Signal Descriptions
   4. 6.4 Connections for Unused Pins
8. 7 Specifications
   1. 7.1  Absolute Maximum Ratings
   2. 7.2  ESD Ratings
   3. 7.3  Recommended Operating Conditions
   4. 7.4  Thermal Information
   5. 7.5  Supply Current Characteristics
      1. 7.5.1 RUN/SLEEP Modes
      2. 7.5.2 STOP/STANDBY Modes
      3. 7.5.3 SHUTDOWN Mode
   6. 7.6  Power Supply Sequencing
      1. 7.6.1 Power Supply Ramp
         1. 7.6.1.1 POR and BOR
   7. 7.7  Flash Memory Characteristics
   8. 7.8  Timing Characteristics
   9. 7.9  Clock Specifications
      1. 7.9.1 System Oscillator (SYSOSC)
      2. 7.9.2 SYSOSC Typical Frequency Accuracy
         1. 7.9.2.1 Low Frequency Oscillator (LFOSC)
      3. 7.9.3 System Phase Lock Loop (SYSPLL)
      4. 7.9.4 Low Frequency Crystal/Clock
      5. 7.9.5 High Frequency Crystal/Clock
   10. 7.10 Digital IO
       1. 7.10.1 Electrical Characteristics
       2. 7.10.2 Switching Characteristics
   11. 7.11 Analog Mux VBOOST
   12. 7.12 ADC
       1. 7.12.1 Electrical Characteristics
       2. 7.12.2 Switching Characteristics
       3. 7.12.3 Linearity Parameters
   13. 7.13 Typical Connection Diagram
   14. 7.14 Temperature Sensor
   15. 7.15 VREF
       1. 7.15.1 Voltage Characteristics
       2. 7.15.2 Electrical Characteristics
   16. 7.16 Comparator (COMP)
       1. 7.16.1 Comparator Electrical Characteristics
   17. 7.17 DAC
       1. 7.17.1 DAC_Supply Specifications
       2. 7.17.2 DAC Output Specifications
       3. 7.17.3 DAC Dynamic Specifications
       4. 7.17.4 DAC Linearity Specifications
       5. 7.17.5 DAC Timing Specifications
   18. 7.18 GPAMP
       1. 7.18.1 Electrical Characteristics
       2. 7.18.2 Switching Characteristics
   19. 7.19 OPA
       1. 7.19.1 Electrical Characteristics
       2. 7.19.2 Switching Characteristics
       3. 7.19.3 PGA Mode
   20. 7.20 I2C
       1. 7.20.1 I2C Characteristics
       2. 7.20.2 I2C Filter
          1. 7.20.2.1 I2C Timing Diagram
   21. 7.21 SPI
       1. 7.21.1 SPI
       2. 7.21.2 SPI Timing Diagram
   22. 7.22 UART
   23. 7.23 TIMx
   24. 7.24 TRNG
       1. 7.24.1 TRNG Electrical Characteristics
       2. 7.24.2 TRNG Switching Characteristics
   25. 7.25 Emulation and Debug
       1. 7.25.1 SWD Timing
9. 8 Detailed Description
   1. 8.1  CPU
   2. 8.2  Operating Modes
      1. 8.2.1 Functionality by Operating Mode (MSPM0G350x)
   3. 8.3  Power Management Unit (PMU)
   4. 8.4  Clock Module (CKM)
   5. 8.5  DMA
   6. 8.6  Events
   7. 8.7  Memory
      1. 8.7.1 Memory Organization
      2. 8.7.2 Peripheral File Map
      3. 8.7.3 Peripheral Interrupt Vector
   8. 8.8  Flash Memory
   9. 8.9  SRAM
   10. 8.10 GPIO
   11. 8.11 IOMUX
   12. 8.12 ADC
   13. 8.13 Temperature Sensor
   14. 8.14 VREF
   15. 8.15 COMP
   16. 8.16 DAC
   17. 8.17 OPA
   18. 8.18 GPAMP
   19. 8.19 TRNG
   20. 8.20 AES
   21. 8.21 CRC
   22. 8.22 MATHACL
   23. 8.23 UART
   24. 8.24 I2C
   25. 8.25 SPI
   26. 8.26 CAN-FD
   27. 8.27 WWDT
   28. 8.28 RTC
   29. 8.29 Timers (TIMx)
   30. 8.30 Device Analog Connections
   31. 8.31 Input/Output Diagrams
   32. 8.32 Serial Wire Debug Interface
   33. 8.33 Bootstrap Loader (BSL)
   34. 8.34 Device Factory Constants
   35. 8.35 Identification
10. 9 Applications, Implementation, and Layout
    1. 9.1 Typical Application
       1. 9.1.1 Schematic
11. 10Device and Documentation Support
    1. 10.1 Getting Started and Next Steps
    2. 10.2 Device Nomenclature
    3. 10.3 Tools and Software
    4. 10.4 Documentation Support
    5. 10.5 Support Resources
    6. 10.6 Trademarks
    7. 10.7 Electrostatic Discharge Caution
    8. 10.8 Glossary
12. 11Revision History
13. 12Mechanical, Packaging, and Orderable Information