SLASFB5 May   2024 MSPM0L1228-Q1 , MSPM0L2228-Q1

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Device Comparison
    1. 5.1 Device Comparison Chart
  7. 6 Pin Configuration and Functions
    1. 6.1 Pin Diagrams
    2. 6.2 Pin Attributes
      1.      11
    3. 6.3 Signal Descriptions
      1.      13
      2.      14
      3.      15
      4.      16
      5.      17
      6.      18
      7.      19
      8.      20
      9.      21
      10.      22
      11.      23
      12.      24
      13.      25
      14.      26
      15.      27
      16.      28
      17.      29
    4. 6.4 Connections for Unused Pins
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Supply Current Characteristics
      1. 7.5.1 RUN/SLEEP Modes
      2. 7.5.2 STOP/STANDBY Modes
      3. 7.5.3 SHUTDOWN Mode
    6. 7.6  Power Supply Sequencing
      1. 7.6.1 Power Supply Ramp
      2. 7.6.2 POR and BOR
    7. 7.7  VBat Characteristics
    8. 7.8  Flash Memory Characteristics
    9. 7.9  Timing Characteristics
    10. 7.10 Clock Specifications
      1. 7.10.1 System Oscillator (SYSOSC)
      2. 7.10.2 Low Frequency Oscillator (LFOSC)
      3. 7.10.3 High Frequency Crystal/Clock
      4. 7.10.4 Low Frequency Crystal/Clock
    11. 7.11 Digital IO
      1. 7.11.1 Electrical Characteristics
      2. 7.11.2 Switching Characteristics
    12. 7.12 Analog Mux VBOOST
    13. 7.13 ADC
      1. 7.13.1 Electrical Characteristics
      2. 7.13.2 Switching Characteristics
      3. 7.13.3 Linearity Parameters
      4. 7.13.4 Typical Connection Diagram
    14. 7.14 Temperature Sensor
    15. 7.15 VREF
      1. 7.15.1 Electrical Characteristics ADC
      2. 7.15.2 Electrical Characteristics (Comparator)
      3. 7.15.3 Voltage Characteristics (ADC)
      4. 7.15.4 Voltage Characteristics (Comparator)
    16. 7.16 Comparator (COMP)
      1. 7.16.1 Comparator Electrical Characteristics
    17. 7.17 LCD
    18. 7.18 I2C
      1. 7.18.1 I2C Characteristics
      2. 7.18.2 I2C Filter
      3. 7.18.3 I2C Timing Diagram
    19. 7.19 SPI
      1. 7.19.1 SPI
      2. 7.19.2 SPI Timing Diagram
    20. 7.20 UART
    21. 7.21 TIMx
    22. 7.22 TRNG
      1. 7.22.1 TRNG Electrical Characteristics
      2. 7.22.2 TRNG Switching Characteristics
    23. 7.23 Emulation and Debug
      1. 7.23.1 SWD Timing
  9. 8 Detailed Description
    1. 8.1  CPU
    2. 8.2  Operating Modes
      1. 8.2.1 Functionality by Operating Mode (MSPM0Lx22x)
    3. 8.3  Security
    4. 8.4  Power Management Unit (PMU)
    5. 8.5  Clock Module (CKM)
    6. 8.6  DMA
    7. 8.7  Events
    8. 8.8  Memory
      1. 8.8.1 Memory Organization
      2. 8.8.2 Peripheral File Map
      3. 8.8.3 Peripheral Interrupt Vector
    9. 8.9  Flash Memory
    10. 8.10 SRAM
    11. 8.11 GPIO
    12. 8.12 IOMUX
    13. 8.13 ADC
    14. 8.14 Temperature Sensor
    15. 8.15 LFSS
    16. 8.16 VREF
    17. 8.17 COMP
    18. 8.18 TRNG
    19. 8.19 AESADV
    20. 8.20 Keystore
    21. 8.21 CRC
    22. 8.22 UART
    23. 8.23 I2C
    24. 8.24 SPI
    25. 8.25 IWDT
    26. 8.26 WWDT
    27. 8.27 RTC_A
    28. 8.28 Timers (TIMx)
    29. 8.29 LCD
    30. 8.30 Device Analog Connections
    31. 8.31 Input/Output Diagrams
    32. 8.32 Serial Wire Debug Interface
    33. 8.33 Bootstrap Loader (BSL)
    34. 8.34 Device Factory Constants
    35. 8.35 Identification
  10. 9 Applications, Implementation, and Layout
    1. 9.1 Typical Application
      1. 9.1.1 Schematic
  11. 10Device and Documentation Support
    1. 10.1 Getting Started and Next Steps
    2. 10.2 Device Nomenclature
    3. 10.3 Tools and Software
    4. 10.4 Documentation Support
    5. 10.5 Support Resources
    6. 10.6 Trademarks
    7. 10.7 Electrostatic Discharge Caution
    8. 10.8 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

8.8.1 Memory Organization

Table 8-4 summarizes the memory map of the devices. For more information about the memory region detail, see the Platform Memory Map section in the MSPM0 Lx22x-Series 32MHz Microcontrollers Technical Reference Manual.

Table 8-4 Memory Organization
MEMORY REGIONSUBREGIONMSP0L1227, MSPM0L2227MSPM0L1228, MSPM0L2228
Code (Flash Bank 0)MAIN ECC Corrected

64KB - 8B(1)

0x0000.0000 to 0x0000.FFF8

128KB - 8B(1)

0x0000.0000 to 0x0001.FFF8
MAIN ECC Uncorrected0x0040.0000 to 0x0040.FFF80x0040.0000 to 0x0041.FFF8
Code (Flash Bank 1)MAIN ECC Corrected

64KB - 8B(1)

0x0002.0000 to 0x0002.FFF8

128KB - 8B(1)

0x0002.0000 to 0x0003.FFF8
MAIN ECC Uncorrected0x0042.0000 to 0x0042.FFF80x0042.0000 to 0x0043.FFF8
SRAM (SRAM)SRAM "ECC Checked"

32KB

0x2000.0000 to 0x2000.7FFF

32KB

0x2000.0000 to 0x2000.7FFF
Parity checked0x2010.0000 to 0x2010.7FFF0x2010.0000 to 0x2010.7FFF
Un-checked0x2020.0000 to 0x2020.7FFF0x2020.0000 to 0x2020.7FFF

ECC/parity

code		0x2030.0000 to 0x2030.7FFF0x2030.0000 to 0x2030.7FFF
PeripheralPeripherals0x4000.4000 to 0x4087.1FFF0x4000.4000 to 0x4087.1FFF
Flash ECC Corrected0x41C0.0000 to 0x41C0.03FF0x41C0.0000 to 0x41C0.03FF
Flash ECC Uncorrected0x41C1.0000 to 0x41C1.03FF0x41C1.0000 to 0x41C1.03FF
Flash ECC code0x41C2.0000 to 0x41C2.03FF0x41C2.0000 to 0x41C2.03FF
Configuration NVM (NONMAIN) Corrected

512 bytes

0x41C4.0000 to 0x41C4.01FF

512 bytes

0x41C4.0000 to 0x41C4.01FF
Configuration NVM (NONMAIN) Uncorrected0x41C5.0000 to 0x41C5.01FF0x41C5.0000 to 0x41C5.01FF
Configuration NVM (NONMAIN) ECC code0x41C6.0000 to 0x41C6.01FF0x41C6.0000 to 0x41C6.01FF
FACTORY Corrected0x41C8.0000 to 0x41C8.03FF0x41C8.0000 to 0x41C8.03FF
FACTORY Uncorrected0x41C9.0000 to 0x41C9.03FF0x41C9.0000 to 0x41C9.03FF
FACTORY ECC code0x41CA.0000 to 0x41CA.03FF0x41CA.0000 to 0x41CA.03FF
Subsystem0x6000.0000 to 0x7FFF.FFFF0x6000.0000 to 0x7FFF.FFFF
System PPB0xE000.0000 to 0xE00F.FFFF0xE000.0000 to 0xE00F.FFFF
(1) First 32KB flash memory (address 0x0000.0000 to 0x0000.8000) has up to 100000 program/erase cycles.