SLASFB5A May   2024  – November 2024 MSPM0L1228-Q1 , MSPM0L2228-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Device Comparison
    1. 5.1 Device Comparison Chart
  7. 6 Pin Configuration and Functions
    1. 6.1 Pin Diagrams
    2. 6.2 Pin Attributes
      1.      11
    3. 6.3 Signal Descriptions
      1.      13
      2.      14
      3.      15
      4.      16
      5.      17
      6.      18
      7.      19
      8.      20
      9.      21
      10.      22
      11.      23
      12.      24
      13.      25
      14.      26
      15.      27
      16.      28
      17.      29
    4. 6.4 Connections for Unused Pins
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Supply Current Characteristics
      1. 7.5.1 RUN/SLEEP Modes
      2. 7.5.2 STOP/STANDBY Modes
      3. 7.5.3 SHUTDOWN Mode
    6. 7.6  Power Supply Sequencing
      1. 7.6.1 Power Supply Ramp
      2. 7.6.2 POR and BOR
    7. 7.7  VBat Characteristics
    8. 7.8  Flash Memory Characteristics
    9. 7.9  Timing Characteristics
    10. 7.10 Clock Specifications
      1. 7.10.1 System Oscillator (SYSOSC)
      2. 7.10.2 Low Frequency Oscillator (LFOSC)
      3. 7.10.3 Low Frequency Crystal/Clock
      4. 7.10.4 High Frequency Crystal/Clock
    11. 7.11 Digital IO
      1. 7.11.1 Electrical Characteristics
      2. 7.11.2 Switching Characteristics
    12. 7.12 Analog Mux VBOOST
    13. 7.13 ADC
      1. 7.13.1 Electrical Characteristics
      2. 7.13.2 Switching Characteristics
      3. 7.13.3 Linearity Parameters
      4. 7.13.4 Typical Connection Diagram
    14. 7.14 Temperature Sensor
    15. 7.15 VREF
      1. 7.15.1 Electrical Characteristics ADC
      2. 7.15.2 Electrical Characteristics (Comparator)
      3. 7.15.3 Voltage Characterisitcs (ADC)
      4. 7.15.4 Voltage Characterisitcs (Comparator)
    16. 7.16 Comparator (COMP)
      1. 7.16.1 Comparator Electrical Characteristics
    17. 7.17 LCD
    18. 7.18 I2C
      1. 7.18.1 I2C Characteristics
      2. 7.18.2 I2C Filter
      3. 7.18.3 I2C Timing Diagram
    19. 7.19 SPI
      1. 7.19.1 SPI
      2. 7.19.2 SPI Timing Diagram
    20. 7.20 UART
    21. 7.21 TIMx
    22. 7.22 TRNG
      1. 7.22.1 TRNG Electrical Characteristics
      2. 7.22.2 TRNG Switching Characteristics
    23. 7.23 Emulation and Debug
      1. 7.23.1 SWD Timing
  9. 8 Detailed Description
    1. 8.1  Functional Block Diagram
    2. 8.2  CPU
    3. 8.3  Operating Modes
      1. 8.3.1 Functionality by Operating Mode (MSPM0Lx22x)
    4. 8.4  Security
    5. 8.5  Power Management Unit (PMU)
    6. 8.6  Clock Module (CKM)
    7. 8.7  DMA
    8. 8.8  Events
    9. 8.9  Memory
      1. 8.9.1 Memory Organization
      2. 8.9.2 Peripheral File Map
      3. 8.9.3 Peripheral Interrupt Vector
    10. 8.10 Flash Memory
    11. 8.11 SRAM
    12. 8.12 GPIO
    13. 8.13 IOMUX
    14. 8.14 ADC
    15. 8.15 Temperature Sensor
    16. 8.16 LFSS
    17. 8.17 VREF
    18. 8.18 COMP
    19. 8.19 TRNG
    20. 8.20 AESADV
    21. 8.21 Keystore
    22. 8.22 CRC
    23. 8.23 UART
    24. 8.24 I2C
    25. 8.25 SPI
    26. 8.26 IWDT
    27. 8.27 WWDT
    28. 8.28 RTC_A
    29. 8.29 Timers (TIMx)
    30. 8.30 LCD
    31. 8.31 Device Analog Connections
    32. 8.32 Input/Output Diagrams
    33. 8.33 Serial Wire Debug Interface
    34. 8.34 Bootstrap Loader (BSL)
    35. 8.35 Device Factory Constants
    36. 8.36 Identification
  10. 9 Applications, Implementation, and Layout
    1. 9.1 Typical Application
      1. 9.1.1 Schematic
  11. 10Device and Documentation Support
    1. 10.1 Getting Started and Next Steps
    2. 10.2 Device Nomenclature
    3. 10.3 Tools and Software
    4. 10.4 Documentation Support
    5. 10.5 Support Resources
    6. 10.6 Trademarks
    7. 10.7 Electrostatic Discharge Caution
    8. 10.8 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

7.4 Thermal Information

THERMAL METRIC(1) PACKAGE VALUE UNIT
RθJA Junction-to-ambient thermal resistance LQFP-80 (PN) 59.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 19.8 °C/W
RθJB Junction-to-board thermal resistance 39.5 °C/W
ΨJT Junction-to-top characterization parameter 1.0 °C/W
ΨJB Junction-to-board characterization parameter 38.9 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W
RθJA Junction-to-ambient thermal resistance LQFP-64 (PM) 63.1 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 22.7 °C/W
RθJB Junction-to-board thermal resistance 40.2 °C/W
ΨJT Junction-to-top characterization parameter 1.1 °C/W
ΨJB Junction-to-board characterization parameter 39.7 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W
RθJA Junction-to-ambient thermal resistance VQFN-48 (RGZ) 29.3 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 20.1 °C/W
RθJB Junction-to-board thermal resistance 11.7 °C/W
ΨJT Junction-to-top characterization parameter 0.3 °C/W
ΨJB Junction-to-board characterization parameter 11.7 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 3.5 °C/W
RθJA Junction-to-ambient thermal resistance LQFP-48 (PT) 72.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 28.5 °C/W
RθJB Junction-to-board thermal resistance 44.5 °C/W
ΨJT Junction-to-top characterization parameter 1.6 °C/W
ΨJB Junction-to-board characterization parameter 44.0 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W
RθJA Junction-to-ambient thermal resistance VQFN-32 (RHB) 33.1 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 24.2 °C/W
RθJB Junction-to-board thermal resistance 13.3 °C/W
ΨJT Junction-to-top characterization parameter 0.3 °C/W
ΨJB Junction-to-board characterization parameter 13.3 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 3.5 °C/W
RθJA Junction-to-ambient thermal resistance VQFN-24 (RGE) 40.7 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 32.3 °C/W
RθJB Junction-to-board thermal resistance 18.1 °C/W
ΨJT Junction-to-top characterization parameter 0.5 °C/W
ΨJB Junction-to-board characterization parameter 18.0 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 3.6 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.