SLAU278AH May 2009 – March 2021
For bootloader use, the BSL connector and only one of the resistors R10 or R11 must be populated. If the board is supplied internally, R11 (0 Ω) must be assembled. If the board is supplied externally, R10 (0 Ω) must be assembled, and R11 must be removed.
The MSP-TS430PEU128 Rev 1.1 ships with the following modifications:
Pos. | Ref Des | No. Per Board | Description | Digi-Key Part No. | Comment |
---|---|---|---|---|---|
1 | PCB | 1 | 94x119.4mm, 4 layers | MSP-TS430PEU128 Rev. 1.1 | 4 layers, green solder mask |
2 | D1 | 1 | green LED, DIODE0805 | 516-1434-1-ND | |
3 | JP1, JP2, JP4 | 3 | 2-pin header, male, TH | SAM1035-02-ND | Place jumper on header |
4 | JP5, JP6, JP7, JP8, JP9, JP10 | 6 | 3-pin header, male, TH | SAM1035-03-ND | Place jumpers on pins 1-2 (SBW) |
5 | JP11, JP12, JP13 | 3 | 4-pin header, male, TH | SAM1035-04-ND | Place jumpers on pins 1-2 (AVCC=VCC) |
6 | JP3 | 1 | 4-pin header, male, TH | SAM1035-04-ND | Place jumpers on pins 1-2 |
7 | JP1, JP2, JP3, JP4, JP5, JP6, JP7, JP8, JP9, JP10, JP11, JP12, JP13 | 13 | Jumper | WM4592-ND | |
8 | R1, R2, R4, R6, R8 | 5 | 0R, 0805 | 541-0.0ATR-ND | |
9 | R10, R11 | 2 | 0R, 0805 | 541-0.0ATR-ND | DNP |
10 | C3 | 1 | 2.2nF, CSMD0805 | 490-1628-2-ND | DNP |
11 | C13, C14, C16, C17, C18, C19, C29 | 7 | 4.7uF, 6.3V, CSMD0805 | 587-1302-2-ND | |
12 | C11 | 1 | 10uF, 6.3V, CSMD0805 | 445-1372-2-ND | |
13 | C12 | 1 | 10uF, 6.3V, CSMD0805 | 445-1372-2-ND | DNP |
14 | C1, C2 | 2 | 12pF, CSMD0805 | 490-5531-2-ND | DNP |
15 | R5 | 1 | 47K, 0805 | 311-47KARTR-ND | |
16 | C4, C5, C6, C7, C8, C15 | 6 | 100nF, CSMD0805 | 311-1245-2-ND | |
17 | C9 | 1 | 100nF, CSMD0805 | 311-1245-2-ND | DNP |
18 | R3, R7 | 2 | 330R, 0805 | 541-330ATR-ND | |
19 | C10, C26 | 2 | 470nF, CSMD0805 | 587-1282-2-ND | |
20 | BOOTST | 1 | 10-pin connector, male, TH | HRP10H-ND | DNP, keep vias free of solder |
21 | JTAG | 1 | 14-pin connector, male, TH | HRP14H-ND | |
22 | IC1 Socket | 1 | Socket: IC500-1284-009P | Manuf. Yamaichi | |
23 | IC1 | 2 | MSP430F67791IPEU | DNP: enclosed with kit. Is supplied by TI | |
24 | J5 | 1 | 3-pin header, male, TH | SAM1035-03-ND | |
25 | Q1 | 1 | Crystal: MS3V-T1R 32.768kHz 12.5pF ±20ppm | DNP: Crystal enclosed with kit. Keep vias free of solder | |
26 | TP1, TP2 | 2 | Test point | DNP, keep vias free of solder | |
27 | J2,J4 | 2 | 26-pin header, TH | SAM1029-26-ND | DNP: Headers enclosed with kit. Keep vias free of solder. |
28 | J2,J4 | 2 | 26-pin receptable, TH | SAM1213-26-ND | DNP: Receptacles enclosed with kit. Keep vias free of solder. |
29 | J1, J3 | 2 | 38-pin header, TH | SAM1029-38-ND | DNP: Headers enclosed with kit. Keep vias free of solder. |
30 | J1, J3 | 2 | 38-pin receptable, TH | SAM1213-38-ND | DNP: Receptacles enclosed with kit. Keep vias free of solder. |
31 | Rubber feet | 4 | Rubber feet | Buerklin: 20H1724 | apply to bottom side corners |