SLAU278AH May 2009 – March 2021
The development board MSP-TS430PZ100AUSB supports the MSP430FG662x and MSP430FG642x flash devices in the 100-pin QFP package. MSP430FG6626IPZ devices are not included in the MSP-TS430PZ100AUSB kit. Free samples can be ordered from www.ti.com/product/MSP430FG6626/samplebuy.
Pos. | Ref Des | No. Per Board | Description | Digi-Key Part No. | Comment |
---|---|---|---|---|---|
1 | PCB Rev. 1.1 | 1 | 99.65mm x 79.54mm | 2 layers, red solder mask | |
2 | C1, C2 | 2 | 12pF, SMD0805 | DNP: C1, C2 | |
3 | C10, C12, C17, C18 | 9 | 100nF, SMD0805 | 311-1245-2-ND | DNP: C10, C12,C18, C17 |
4 | C15 | 1 | 22nF, CSMD0805 | 311-1242-1-ND | |
5 | C16 | 1 | 4.7 nF SMD0603 | 311-1250-1-ND | |
6 | C3, C4 | 2 | 47pF, CSMD0805 | 709-1337-1-ND | |
7 | C33, C38 | 2 | 220n SMD0603 | Buerklin: 53D2074 | |
8 | C35, C36 | 2 | 10p SMD0603 | Buerklin: 56D102 | |
9 | C39 | 1 | 4u7 SMD0603 | Buerklin: 53D2086 | |
10 | C40 | 1 | 0.1u SMD0603 | Buerklin: 53D2068 | |
11 | C5, C11, C13, C14, C19 | 5 | 100nF, SMD0805 | 311-1245-2-ND | |
12 | C6, C7 | 2 | 10uF/6.3V, Tantal Size B | 511-1463-2-ND | |
13 | C8 | 1 | 2.2nF, CSMD0805 | 709-1339-1-ND | |
14 | C9 | 1 | 470nF, SMD0805 | 478-1403-2-ND | |
15 | D1 | 1 | green LED, HSMG-C170 DIODE0805 | 516-1434-1-ND | Avago, Farnell 5790852 |
16 | D2, D4 | 2 | LL103A, SOD-80 | Buerklin: 24S3406 | |
17 | IC7 | 1 | TPD4E004DRYR | 296-23618-1-ND | Manu: TI |
18 | J1, J2, J3, J4 | 4 | 25-pin header, TH | SAM1029-25-ND | DNP: Headers enclosed in kit. Keep vias free of solder. |
19 | J1, J2, J3, J4 | 4 | 25-pin receptacle, TH | SAM1213-25-ND | DNP: Receptacles enclosed in kit. Keep vias free of solder. |
20 | J5 | 1 | 3-pin header, male, TH | SAM1035-03-ND | |
21 | JP1, JP2, JP4 | 3 | 2-pin header, male, TH | SAM1035-02-ND | place jumper on header |
22 | JP11 | 1 | 4-pin header, male, TH | SAM1035-04-ND | Place jumper on Pin 1 and 2 |
23 | JP3 | 1 | 3-pin header, male, TH | SAM1035-03-ND | place jumper on pins 1-2 |
24 | JP5, JP6, JP7, JP8, JP9, JP10 | 6 | 3-pin header, male, TH | SAM1035-03-ND | place jumpers on pins 2-3 |
25 | Jumpers for JP1, JP2, JP3, JP4, JP5, JP6, JP7, JP8, JP9, JP10, JP11 | 11 | Jumper | 15-38-1024-ND | |
26 | JTAG | 1 | 14-pin connector, male, TH | HRP14H-ND | |
27 | LED | 1 | JP3QE | SAM1032-03-ND | DNP |
28 | LED1, LED2, LED3 | 3 | FARNELL: 852-9833 | DNP | |
29 | MSP430 | 2 | MSP430FG6626IPZ | DNP: Free samples can be ordered in the TI Store | |
30 | Q2 | 1 | Crystal | Q2: 4MHz Buerklin: 78D134 | |
31 | Q3 | 1 | MS3V-T1R (32.768kHz/ 20ppm/12.5pF) | ||
32 | R1, R2, R4 | 3 | 0 Ohm, SMD0805 | 541-0.0ATR-ND | |
33 | R10 | 1 | 100R, R0603 | 541-100GCT-ND | |
34 | R11 | 1 | 1M, R0603 | 541-1.0MGCT-ND | |
35 | R13, R15, R16 | 3 | 470R SMD0603 | Buerklin: 07E564 | DNP |
36 | R14 | 1 | 0 Ohm, SMD0805 | 541-0.0ATR-ND | |
37 | R3 | 1 | 330 Ohm, SMD0805 | 541-330ATR-ND | |
38 | R33 | 1 | 1k4 / 1k5 SMD0603 | Buerklin: 07E612 | |
39 | R34, R35 | 2 | 27R SMD0603 | Buerklin: 07E444 | |
40 | R36 | 1 | 33k SMD0603 | Buerklin: 07E740 | |
41 | R5 | 1 | 47k Ohm, SMD0805 | 541-47000ATR-ND | |
42 | R6, R8, R9, R12 | 4 | 0 Ohm, SMD0805 | 541-000ATR-ND | DNP |
43 | S1, S2 | 1 | PB | P12225STB-ND | DNP |
44 | S3 | 1 | PB | P12225STB-ND | |
45 | TP1, TP2 | 2 | Test point | DNP, Keep vias free of solder | |
46 | U1 | 1 | Socket: IC357-1004-53N | Manuf.: Yamaichi | |
47 | USB1 | 1 | USB Receptacle | FARNELL: 117-7885 | |
48 | Insulating disk for Q2 | 1 | Insulating disk for Q2 | ettinger.de 70.08.121 | |
49 | Rubber stand off | 4 | Buerklin: 20H1724 | Apply to corners at bottom side |