SLAU278AH May 2009 – March 2021
For bootloader use, the BSL connector and only one of the resistors R2 or R3 need to be populated. If the board is supplied internally, R3 (0 Ω) must be assembled. If the board is supplied externally, R2 (0 Ω) must be assembled, and R3 must be removed.
Position | Ref Des | No. per Board | Description | Digi-Key Part No. | Comment |
---|---|---|---|---|---|
1 | C1, C2 | 0 | 12pF, SMD0805 | DNP | |
2 | C5 | 1 | 2.2nF, SMD0805 | ||
3 | C3 | 1 | 10uF, 10V, SMD0805 | ||
4 | C4, C6, | 2 | 100nF, SMD0805 | 478-3351-2-ND | |
5 | D1 | 1 | green LED, SMD0805 | P516TR-ND | |
6 | J1, J2 | 0 | 14-pin header, TH | DNP: Headers and receptacles enclosed with kit. Keep vias free of solder: (Header and Receptacle) | |
7 | J5, JP1, JP4, JP5, JP6, JP7, JP8, JP9 | 8 | 3-pin header, male, TH | SAM1035-03-ND | Place jumper on 1-2 of JP4-JP9 Place on 1-2 on JP1 |
8 | JP2, JP3 | 2 | 2-pin header, male, TH | SAM1035-02-ND | Place jumper on header |
9 | 9 | Jumper | 15-38-1024-ND | see Pos 7 an 8 | |
10 | JTAG | 1 | 14-pin connector, male, TH | HRP14H-ND | |
11 | BOOTST | 0 | DNP Keep vias free of solder | ||
12 | Q1 | 0 | Crystal | Micro Crystal MS3V 32.768kHz, C(Load) = 12.5pF | DNP: keep vias free of solder |
13 | R1, R7 | 2 | 330 Ω, SMD0805 | 541-330ATR-ND | |
14 | R2, R3,R5, R6, | 0 | 0 Ohm, SMD0805 | 541-000ATR-ND | DNP R2, R3,R5, R6 |
15 | R4 | 1 | 47k Ω, SMD0805 | 541-47000ATR-ND | |
16 | U1 | 1 | Socket: OTS-28-0.65-01 | Manuf.: Enplas | |
17 | PCB | 1 | 63.5 x 64.8 mm | 2 layers | |
18 | Adhesive plastic feet | 4 | Approximately 6mm width, 2mm height | for example, 3M Bumpons Part No. SJ-5302 | Apply to corners at bottom side |
19 | MSP430 | 2 | MSP430G2553IPW28 | DNP: enclosed with kit, supplied by TI |