SLAU278AH May 2009 – March 2021
The MSP-TS430PW20 microcontroller development board supports the MSP430FR23x and MSP430FR21x FRAM devices in both 20-pin and 16-pin TSSOP (TI package code PW) packages. No microcontroller devices are included in the MSP-TS430PW20 kit, but can be ordered from the TI Store.
The MSP-TS430PW20 microcontroller development board has two jumpers on header J11 that direct the UART BSL signals, depending on which device is being used (see Figure 5-9).
Pos. | Ref Des | No. Per Board | Description | Digi-Key Part No. | Comment |
---|---|---|---|---|---|
1 | PCB | 1 | 90.0 x 92.5 mm | "MSP-TS430PW20" Rev. 1.1 | 2 layers, green solder mask |
2 | JP1, JP9, JP13, JP14, JP15 | 5 | 2-pin header, male, TH | SAM1035-02-ND | place jumper on header |
3 | JP17, JP18 | 2 | 2-pin header, male, TH | SAM1035-02-ND | place jumper on one pin only |
4 | JP2, JP10 | 2 | 2-pin header, male, TH | SAM1035-02-ND | DNP, keep pads free of solder |
5 | J1 | 1 | 3-pin header, male, TH | SAM1035-03-ND | place jumpers on pins 1-2 |
6 | JP3, JP4, JP5, JP6, JP7, JP8 | 6 | 3-pin header, male, TH | SAM1035-03-ND | place jumpers on pins 1-2 |
7 | JP16 | 1 | 3-pin header, male, TH | SAM1035-03-ND | place jumpers on pins 2-3 |
8 | J2 | 1 | 3-pin header, male, TH | SAM1035-03-ND | |
9 | JP11 | 1 | 2x3pin header, male, TH | SAM1034-03-ND | PW20: Place jumpers on pins 1-3 and 2-4 PW16: Place jumpers on pins 3-5 and 4-6 |
10 | R2, R8, R9 | 3 | 0R, 0805 | 541-0.0ATR-ND | DNP |
11 | R3, R13 | 2 | 0R, 0805 | 541-0.0ATR-ND | |
12 | C5 | 1 | 1.1nF, CSMD0805 | 490-1623-2-ND | |
13 | C7 | 1 | 1uF/10V, CSMD0805 | 490-1702-2-ND | |
14 | R7, R15 | 1 | 10k, 0805 | 541-10KATR-ND | |
15 | R4 | 1 | 47k, 0805 | 541-47KATR-ND | |
16 | C6, C11 | 2 | 100nF, CSMD0805 | 490-1666-1-ND | |
17 | C8, C9 | 2 | 12p, DNP, CSMD0805 | BC1257TR-ND | DNP |
18 | R1 | 1 | 330R, 0805 | 541-330ATR-ND | |
19 | R5, R6 | 2 | 330R, 0805 | 541-330ATR-ND | DNP |
20 | R14 | 1 | 47k, 0805 | 541-47KATR-ND | DNP |
21 | SW2 | 1 | EVQ-11L05R | P8079STB-ND | DNP, Keep vias free of solder |
22 | SW1 | 1 | EVQ-11L05R | P8079STB-ND | DNP, Keep vias free of solder |
23 | J3, J4 | 2 | 10-pin header, TH | SAM1029-10-ND | DNP: headers are enclosed with kit. Keep vias free of solder. |
24 | J3, J4 | 2 | 10-pin receptacle, TH | SAM1213-10-ND | DNP: Receptacles are enclosed with kit. Keep vias free of solder. |
25 | TP1, TP2, TP3 | 3 | Test point | DNP, keep pads free of solder | |
26 | BSL | 1 | 10-pin connector, male, TH | HRP10H-ND | |
27 | JTAG | 1 | 14-pin connector, male, TH | HRP14H-ND | |
28 | IC1 | 1 | Socket: OTS-20S-0.65-007 | Manuf. Enplas | |
29 | IC1 | 1 | MSP430FR2311IPW20 | DNP: Free samples can be ordered in the TI Store | |
30 | Q2 | 1 | 4MHz Crystal | 4MHz Buerklin: 78D134 | DNP: Crystal is enclosed with kit |
31 | Q2 | 1 | MSV3V-T1R (32.768kHz / 20ppm / 12.5pF) | DNP: Crystal is enclosed with kit | |
32 | D1 | 1 | green LED, HSMG-C170 DIODE0805 | 516-1434-1-ND | Avago, Farnell 5790852 |
33 | D3 | 1 | red LED, DIODE0805 | DNP | |
34 | D2 | 1 | yellow LED, DIODE0805 | DNP | |
35 | Rubber stand off | 4 | Buerklin: 20H1724 | apply to corners at bottom side |