SLAU278AH May 2009 – March 2021
For bootloader use, the BSL connector and only one of the resistors R2 or R3 need to be populated. If the board is supplied internally, R3 (0 Ω) must be assembled. If the board is supplied externally, R2 (0 Ω) must be assembled, and R3 must be removed.
Pos. | Ref Des | No. per Board | Description | Digi-Key Part No. | Comment |
---|---|---|---|---|---|
1 | C1, C2 | 0 | 12pF, SMD0805 | DNP | |
2 | C3 | 1 | 10uF, 10V, Tantal Size B | 511-1463-2-ND | |
3 | C4 | 1 | 100nF, SMD0805 | 478-3351-2-ND | |
4 | C5 | 1 | 10nF, SMD0805 | 478-1383-2-ND | |
5 | D1 | 1 | green LED, SMD0603 | 475-1056-2-ND | |
6 | J1, J2, J3, J4 | 0 | 10-pin header, TH | DNP: headers and receptacles enclosed with kit.Keep vias free of solder. | |
SAM1034-10-ND | : Header | ||||
SAM1212-10-ND | : Receptacle | ||||
7 | J5, JP1 | 2 | 3-pin header, male, TH | SAM1035-03-ND | Place jumper on header JP1; Pos 1-2. |
8 | JP2, JP3 | 2 | 2-pin header, male, TH | SAM1035-02-ND | Place jumper on header |
9 | 3 | Jumper | 15-38-1024-ND | Place on: JP1, JP2, JP3 | |
10 | JTAG | 1 | 14-pin connector, male, TH | HRP14H-ND | |
11 | BOOTST | 0 | 10-pin connector, male, TH | DNP: Keep vias free of solder | |
12 | Q1 | 0 | Crystal | Micro Crystal MS1V-T1K 32.768kHz, C(Load) = 12.5pF | DNP: Keep vias free of solder |
13 | R1 | 1 | 330 Ω, SMD0805 | 541-330ATR-ND | |
14 | R2, R3 | 0 | 0 Ω, SMD0805 | 541-000ATR-ND | DNP |
15 | R4 | 1 | 47k Ω, SMD0805 | 541-47000ATR-ND | |
16 | U1 | 1 | Socket: QFN-40B-0.5-01 | Manuf.: Enplas | |
17 | PCB | 1 | 79 x 66 mm | 2 layers | |
18 | Adhesive Plastic feet | 4 | ~6mm width, 2mm height | for example, 3M Bumpons Part No. SJ-5302 | Apply to corners at bottom side |
19 | MSP430 | 2 | MSP430F2370IRHA | DNP: enclosed with kit supplied by TI |