SLAU278AH May 2009 – March 2021
Due to the use of diodes in the power chain, the voltage on the MSP430F5xx device is approximately 0.3 V lower than is set by the debugging tool. Set the voltage in the IDE to 0.3 V higher than desired; for example, to run the MCU at 3.0 V, set it to 3.3 V.
Pos. | Ref Des | No. Per Board | Description | Digi-Key Part No. | Comment |
---|---|---|---|---|---|
1 | C1, C2 | 0 | 12pF, SMD0805 | DNP: C1, C2 | |
1.1 | C3, C4 | 2 | 47pF, SMD0805 | ||
2 | C6, C7 | 2 | 10uF, 6.3V, Tantal Size B | 511-1463-2-ND | |
3 | C5, C11, C13, C14 | 4 | 100nF, SMD0805 | 311-1245-2-ND | |
3.1 | C10, C12 | 0 | 10uF, SMD0805 | DNP: C10, C12 | |
4 | C8 | 1 | 2.2nF, SMD0805 | ||
5 | C9 | 1 | 470nF, SMD0805 | 478-1403-2-ND | |
6 | D1 | 1 | green LED, SMD0805 | P516TR-ND | |
7 | J1, J2, J3, J4 | 4 | 16-pin header, TH | DNP: headers and receptacles enclosed with kit. Keep vias free of solder. | |
SAM1029-16-ND | : Header | ||||
SAM1213-16-ND | : Receptacle | ||||
8 | J5 | 1 | 3-pin header, male, TH | SAM1035-03-ND | |
9 | JP5, JP6, JP7, JP8, JP9, JP10 | 6 | 3-pin header, male, TH | SAM1035-03-ND | place jumpers on pins 2-3 |
10 | JP1, JP2, JP4 | 3 | 2-pin header, male, TH | SAM1035-02-ND | place jumper on header |
11 | JP3 | 1 | 3-pin header, male, TH | SAM1035-03-ND | place jumper on pins 1-2 |
12 | 10 | Jumper | 15-38-1024-ND | Place on: JP1, JP2, JP3, JP4, JP5, JP6, JP7, JP8, JP9, JP10 | |
13 | JTAG | 1 | 14-pin connector, male, TH | HRP14H-ND | |
14 | Q1 | 0 | Crystal | Q1: Micro Crystal MS1V-T1K 32.768kHz, C(Load) = 12.5pF | DNP: Q1 Keep vias free of solder |
15 | Q2 | 1 | Crystal | Q2: 4MHz Buerklin: 78D134 | |
16 | R3, R7 | 2 | 330 Ω, SMD0805 | 541-330ATR-ND | |
17 | R1, R2, R4, R6, R8, R9, R12 | 2 | 0 Ω, SMD0805 | 541-000ATR-ND | DNP: R4, R6, R8, R9, R12 |
18 | R10 | 1 | 100 Ω, SMD0805 | Buerklin: 07E500 | |
18 | R11 | 1 | 1M Ω, SMD0805 | ||
18 | R5 | 1 | 47k Ω, SMD0805 | 541-47000ATR-ND | |
19 | U1 | 1 | Socket: QFN11T064-006 | Manuf.: Yamaichi | |
20 | PCB | 1 | 79 x 77 mm | 2 layers | |
21 | Rubber stand off | 4 | Buerklin: 20H1724 | Apply to corners at bottom side | |
22 | MSP430 | 2 | MSP430F5509 RGC | DNP: enclosed with kit. Is supplied by TI | |
23 | Insulating disk to Q2 | 1 | Insulating disk to Q2 | http://www.ettinger.de/Art_Detail.cfm?ART_ARTNUM=70.08.121 | |
27 | C33 | 1 | 220n SMD0603 | Buerklin: 53D2074 | |
28 | C35 | 1 | 10p SMD0603 | Buerklin: 56D102 | |
29 | C36 | 1 | 10p SMD0603 | Buerklin: 56D102 | |
30 | C38 | 1 | 220n SMD0603 | Buerklin: 53D2074 | |
31 | C39 | 1 | 4u7 SMD0603 | Buerklin: 53D2086 | |
32 | C40 | 1 | 0.1u SMD0603 | Buerklin: 53D2068 | |
33 | D2, D3, D4 | 3 | LL103A | Buerklin: 24S3406 | |
34 | IC7 | 1 | TPD4E004 | Manu: TI | |
36 | LED | 0 | JP3QE | SAM1032-03-ND | DNP |
37 | LED1 | 0 | LEDCHIPLED_0603 | FARNELL: 852-9833 | DNP |
38 | LED2 | 0 | LEDCHIPLED_0603 | FARNELL: 852-9868 | DNP |
39 | LED3 | 0 | LEDCHIPLED_0603 | FARNELL: 852-9841 | DNP |
40 | R13, R15, R16 | 0 | 470R | Buerklin: 07E564 | DNP |
41 | R33 | 1 | 1k4 / 1k5 | Buerklin: 07E612 | |
42 | R34 | 1 | 27R | Buerklin: 07E444 | |
43 | R35 | 1 | 27R | Buerklin: 07E444 | |
44 | R36 | 1 | 33k | Buerklin: 07E740 | |
45 | S1 | 0 | PB | P12225STB-ND | DNP |
46 | S2 | 0 | PB | P12225STB-ND | DNP |
46 | S3 | 1 | PB | P12225STB-ND | |
47 | USB1 | 1 | USB_RECEPTACLE | FARNELL: 117-7885 |