SLAU739 October   2017

 

  1.   MSP430FR2433 LaunchPad™ Development Kit (MSP‑EXP430FR2433)
    1.     Trademarks
    2. 1 Getting Started
      1. 1.1 Introduction
      2. 1.2 Key Features
      3. 1.3 What's Included
        1. 1.3.1 Kit Contents
        2. 1.3.2 Software Examples
      4. 1.4 First Steps: Out-of-Box Experience
        1. 1.4.1 Connecting to the Computer
        2. 1.4.2 Running the Out-of-Box Demo
      5. 1.5 Next Steps: Looking Into the Provided Code
    3. 2 Hardware
      1. 2.1 Block Diagram
      2. 2.2 Hardware Features
        1. 2.2.1 MSP430FR2433 MCU
        2. 2.2.2 eZ-FET Onboard Debug Probe With EnergyTrace Technology
        3. 2.2.3 Debug Probe Connection: Isolation Jumper Block
        4. 2.2.4 Application (or Backchannel) UART
        5. 2.2.5 Optional Features
          1. 2.2.5.1 Supercapacitor
      3. 2.3 Power
        1. 2.3.1 eZ-FET USB Power
        2. 2.3.2 BoosterPack and External Power Supply
        3. 2.3.3 Supercap (C6)
          1. 2.3.3.1 Charging the Supercap
          2. 2.3.3.2 Using the Supercap
          3. 2.3.3.3 Disabling the Supercap
      4. 2.4 Measure Current Draw of the MSP430 MCU
      5. 2.5 Clocking
      6. 2.6 Using the eZ-FET Debug Probe With a Different Target
      7. 2.7 BoosterPack Pinout
      8. 2.8 Design Files
        1. 2.8.1 Hardware
        2. 2.8.2 Software
      9. 2.9 Hardware Change log
    4. 3 Software Examples
      1. 3.1 Out-of-Box Software Example
        1. 3.1.1 Source File Structure
        2. 3.1.2 Overview
        3. 3.1.3 FRAM Data Logging Mode
        4. 3.1.4 Live Temperature Mode
      2. 3.2 Blink LED Example
        1. 3.2.1 Source File Structure
    5. 4 Resources
      1. 4.1 Integrated Development Environments
        1. 4.1.1 TI Cloud Development Tools
          1. 4.1.1.1 TI Resource Explorer Cloud
          2. 4.1.1.2 Code Composer Studio Cloud
        2. 4.1.2 Code Composer Studio IDE
        3. 4.1.3 IAR Embedded Workbench for Texas Instruments 430
      2. 4.2 LaunchPad Websites
      3. 4.3 MSPWare and TI Resource Explorer
      4. 4.4 FRAM Utilities
        1. 4.4.1 Compute Through Power Loss (CTPL)
        2. 4.4.2 Nonvolatile Storage (NVS)
      5. 4.5 MSP430FR2433 MCU
        1. 4.5.1 Device Documentation
        2. 4.5.2 MSP430FR2433 Code Examples
        3. 4.5.3 MSP430 Application Notes and TI Designs
      6. 4.6 Community Resources
        1. 4.6.1 TI E2E Community
        2. 4.6.2 Community at Large
    6. 5 FAQ
    7. 6 Schematics

2.2.3 Debug Probe Connection: Isolation Jumper Block

The isolation jumper block at jumper J101 allows the user to connect or disconnect signals that cross from the eZ-FET domain into the MSP430FR2433 target domain. This includes eZ-FET Spy-Bi-Wire signals, application UART signals, and 3.3-V and 5-V power. Table 2 describes these connections.

Reasons to open these connections:

  • To remove any and all influence from the eZ-FET debug probe for high accuracy target power measurements
  • To control 3-V and 5-V power flow between the eZ-FET and target domains
  • To expose the target MCU pins for other use than onboard debugging and application UART communication
  • To expose the programming and UART interface of the eZ-FET so that it can be used for devices other than the onboard MCU. See Section 2.6 for how to use the eZ-FET Debug Probe with a different target.

Table 2. Isolation Block Connections

Jumper Description
GND Ground
5V 5-V VBUS from USB
3V3 3.3-V rail, derived from VBUS in the eZ-FET domain
RXD << Backchannel UART: The target FR2433 receives data through this signal. The arrows indicate the direction of the signal.
TXD >> Backchannel UART: The target FR2433 sends data through this signal. The arrows indicate the direction of the signal.
SBW RST Spy-Bi-Wire debug: SBWTDIO data signal. This pin also functions as the RST signal (active low).
SBW TST Spy-Bi-Wire debug: SBWTCK clock signal. This pin also functions as the TST signal.
ez-fet-isolation-jumper-block-diagram.gifFigure 6. eZ-FET Isolation Jumper Block Diagram