SLAU739 October   2017

 

  1.   MSP430FR2433 LaunchPad™ Development Kit (MSP‑EXP430FR2433)
    1.     Trademarks
    2. 1 Getting Started
      1. 1.1 Introduction
      2. 1.2 Key Features
      3. 1.3 What's Included
        1. 1.3.1 Kit Contents
        2. 1.3.2 Software Examples
      4. 1.4 First Steps: Out-of-Box Experience
        1. 1.4.1 Connecting to the Computer
        2. 1.4.2 Running the Out-of-Box Demo
      5. 1.5 Next Steps: Looking Into the Provided Code
    3. 2 Hardware
      1. 2.1 Block Diagram
      2. 2.2 Hardware Features
        1. 2.2.1 MSP430FR2433 MCU
        2. 2.2.2 eZ-FET Onboard Debug Probe With EnergyTrace Technology
        3. 2.2.3 Debug Probe Connection: Isolation Jumper Block
        4. 2.2.4 Application (or Backchannel) UART
        5. 2.2.5 Optional Features
          1. 2.2.5.1 Supercapacitor
      3. 2.3 Power
        1. 2.3.1 eZ-FET USB Power
        2. 2.3.2 BoosterPack and External Power Supply
        3. 2.3.3 Supercap (C6)
          1. 2.3.3.1 Charging the Supercap
          2. 2.3.3.2 Using the Supercap
          3. 2.3.3.3 Disabling the Supercap
      4. 2.4 Measure Current Draw of the MSP430 MCU
      5. 2.5 Clocking
      6. 2.6 Using the eZ-FET Debug Probe With a Different Target
      7. 2.7 BoosterPack Pinout
      8. 2.8 Design Files
        1. 2.8.1 Hardware
        2. 2.8.2 Software
      9. 2.9 Hardware Change log
    4. 3 Software Examples
      1. 3.1 Out-of-Box Software Example
        1. 3.1.1 Source File Structure
        2. 3.1.2 Overview
        3. 3.1.3 FRAM Data Logging Mode
        4. 3.1.4 Live Temperature Mode
      2. 3.2 Blink LED Example
        1. 3.2.1 Source File Structure
    5. 4 Resources
      1. 4.1 Integrated Development Environments
        1. 4.1.1 TI Cloud Development Tools
          1. 4.1.1.1 TI Resource Explorer Cloud
          2. 4.1.1.2 Code Composer Studio Cloud
        2. 4.1.2 Code Composer Studio IDE
        3. 4.1.3 IAR Embedded Workbench for Texas Instruments 430
      2. 4.2 LaunchPad Websites
      3. 4.3 MSPWare and TI Resource Explorer
      4. 4.4 FRAM Utilities
        1. 4.4.1 Compute Through Power Loss (CTPL)
        2. 4.4.2 Nonvolatile Storage (NVS)
      5. 4.5 MSP430FR2433 MCU
        1. 4.5.1 Device Documentation
        2. 4.5.2 MSP430FR2433 Code Examples
        3. 4.5.3 MSP430 Application Notes and TI Designs
      6. 4.6 Community Resources
        1. 4.6.1 TI E2E Community
        2. 4.6.2 Community at Large
    6. 5 FAQ
    7. 6 Schematics

1.1 Introduction

The 16-MHz MSP430FR2433 device features 15.5KB of embedded FRAM (ferroelectric random access memory), a nonvolatile memory known for its ultra-low power, high endurance, and high-speed write access. Combined with the 4KB of on-chip SRAM, users have access to 15.5KB of memory to split between their program and data as required. For example, a data logging application may require a large data memory with a relatively small program memory, so the memory may be allocated as required between program and data memory.

Rapid prototyping is simplified by the 20-pin BoosterPack™ plug-in module headers, which support a wide range of available BoosterPack modules. You can quickly add features like wireless connectivity, graphical displays, environmental sensing, and much more. Design your own BoosterPack plug-in module or choose among many already available from TI and third-party developers.

Free software development tools are also available, such as TI's Eclipse-based Code Composer Studio™ IDE (CCS) and IAR Embedded Workbench® IDE. Both of these IDEs support EnergyTrace™ technology for real-time power profiling and debugging when paired with the MSP430FR2433 LaunchPad development kit.