SLAU869E October   2022  – January 2024

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Getting Started
    1. 1.1 Introduction
    2. 1.2 Key Features
    3. 1.3 What's Included
      1. 1.3.1 Kit Contents
      2. 1.3.2 Software Examples
    4. 1.4 First Step Out-of-Box Experience
      1. 1.4.1 Connecting to the Computer
      2. 1.4.2 Running the Out-of-Box Experience
    5. 1.5 Next Steps: Looking Into the Provided Code
  5. 2Hardware
    1. 2.1 Jumper Map
    2. 2.2 Block Diagram
    3. 2.3 Hardware Features
      1. 2.3.1 MSPM0L1306 MCU
      2. 2.3.2 XDS110-ET Onboard Debug Probe With EnergyTrace Technology
      3. 2.3.3 Debug Probe Connection: Isolation Jumper Block
      4. 2.3.4 Application (or Backchannel) UART
      5. 2.3.5 Using an External Debug Probe Instead of the Onboard XDS110-ET
      6. 2.3.6 Using the XDS110-ET Debug Probe With a Different Target
      7. 2.3.7 Special Features
        1. 2.3.7.1 Thermistor
        2. 2.3.7.2 Light Sensor
    4. 2.4 Power
      1. 2.4.1 XDS110-ET USB Power
    5. 2.5 External Power Supply and BoosterPack Plug-in Module
    6. 2.6 Measure Current Draw of the MSPM0 MCU
    7. 2.7 Clocking
    8. 2.8 BoosterPack Plug-in Module Pinout
  6. 3Software Examples
  7. 4Resources
    1. 4.1 Integrated Development Environments
      1. 4.1.1 TI Cloud Development Tools
      2. 4.1.2 TI Resource Explorer Cloud
      3. 4.1.3 Code Composer Studio Cloud
      4. 4.1.4 Code Composer Studio IDE
    2. 4.2 MSPM0 SDK and TI Resource Explorer
    3. 4.3 MSPM0L1306 MCU
      1. 4.3.1 Device Documentation
      2. 4.3.2 MSPM0L1306 Code Examples
    4. 4.4 Community Resources
      1. 4.4.1 TI E2E Forums
  8. 5Schematics
  9. 6Revision History

1.1 Introduction

The MSPM0L1306 is an Arm® 32-bit Cortex®-M0+ CPU with frequency up to 32MHz. The device features 64KB of embedded flash memory combined with 4KB of on-chip RAM. The integrated high-performance analog peripherals like 12-bit 1-Msps SAR ADC, zero-drift and zero-crossover chopper op-amps (OPA), and a general-purpose amplifier (GPAMP) help users design their system.

Rapid prototyping is simplified by the 40-pin BoosterPack™ plug-in module headers, which support a wide range of available BoosterPack plug-in modules. You can quickly add features like wireless connectivity, graphical displays, environmental sensing, and much more. Design your own BoosterPack plug-in module or choose among many already available from TI and third-party developers.

Free software development tools are also available such as TI's Code Composer Studio™ IDE, IAR Embedded Workbench™ IDE, and Keil® µVision® IDE. Code Composer Studio IDE supports EnergyTrace™ technology when paired with the MSPM0L1306 LaunchPad development kit. More information about the LaunchPad development kit, the supported BoosterPack plug-in modules, and the available resources can be found at the TI LaunchPad™ development kit portal. To get started quickly and find available resources in the MSPM0 software development kit (SDK), visit the TI Cloud Developer Zone. MSPM0 MCUs are also supported by extensive online collateral, training with MSP Academy, and online support through the TI E2E™ support forums.