SLAU869E October   2022  – January 2024

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Getting Started
    1. 1.1 Introduction
    2. 1.2 Key Features
    3. 1.3 What's Included
      1. 1.3.1 Kit Contents
      2. 1.3.2 Software Examples
    4. 1.4 First Step Out-of-Box Experience
      1. 1.4.1 Connecting to the Computer
      2. 1.4.2 Running the Out-of-Box Experience
    5. 1.5 Next Steps: Looking Into the Provided Code
  5. 2Hardware
    1. 2.1 Jumper Map
    2. 2.2 Block Diagram
    3. 2.3 Hardware Features
      1. 2.3.1 MSPM0L1306 MCU
      2. 2.3.2 XDS110-ET Onboard Debug Probe With EnergyTrace Technology
      3. 2.3.3 Debug Probe Connection: Isolation Jumper Block
      4. 2.3.4 Application (or Backchannel) UART
      5. 2.3.5 Using an External Debug Probe Instead of the Onboard XDS110-ET
      6. 2.3.6 Using the XDS110-ET Debug Probe With a Different Target
      7. 2.3.7 Special Features
        1. 2.3.7.1 Thermistor
        2. 2.3.7.2 Light Sensor
    4. 2.4 Power
      1. 2.4.1 XDS110-ET USB Power
    5. 2.5 External Power Supply and BoosterPack Plug-in Module
    6. 2.6 Measure Current Draw of the MSPM0 MCU
    7. 2.7 Clocking
    8. 2.8 BoosterPack Plug-in Module Pinout
  6. 3Software Examples
  7. 4Resources
    1. 4.1 Integrated Development Environments
      1. 4.1.1 TI Cloud Development Tools
      2. 4.1.2 TI Resource Explorer Cloud
      3. 4.1.3 Code Composer Studio Cloud
      4. 4.1.4 Code Composer Studio IDE
    2. 4.2 MSPM0 SDK and TI Resource Explorer
    3. 4.3 MSPM0L1306 MCU
      1. 4.3.1 Device Documentation
      2. 4.3.2 MSPM0L1306 Code Examples
    4. 4.4 Community Resources
      1. 4.4.1 TI E2E Forums
  8. 5Schematics
  9. 6Revision History

4.1.1 TI Cloud Development Tools

TI’s Cloud-based software development tools provide instant access to MSPM0 SDK content and a web-based IDE.