SLAU891A March   2023  – July 2024 TRF0208-SEP

 

  1.   1
  2.   Description
  3.   Features
  4.   4
  5. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
  6. 2Hardware
    1. 2.1 General Usage Information
  7. 3Implementation Results
    1. 3.1 Test Setup Diagrams
      1. 3.1.1 S-Parameter Test Setup
      2. 3.1.2 Noise Figure Test Setup
      3. 3.1.3 Two-Tone OIP3 Test Setup
  8. 4Hardware Design Files
    1. 4.1 Schematic
    2. 4.2 PCB Layers
      1. 4.2.1 Stack-Up and Material
    3. 4.3 TRF0208SEP/SP EVM Bill of Materials
  9. 5Additional Information
    1.     Trademarks
  10. 6Related Documentation
  11. 7Revision History

4.2.1 Stack-Up and Material

The TRF0208SEP/SP EVM is a 4-layer board whose material type is Isola® 370HR. The top layer routes the power, ground, and signals between SMA connectors and the device. Second layer is the reference RF ground layer. The signal trace impedance is targeted at 50Ω. The bottom 3 layers are ground layers.

TRF0208SEP, TRF0208SP TRF0208SEP/SP EVM Stack-Up (Units in Mils)Figure 4-6 TRF0208SEP/SP EVM Stack-Up (Units in Mils)