SLAU949 September   2024

 

  1.   1
  2.   Description
  3.   Features
  4.   4
  5. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  6. 2Hardware
    1. 2.1 EVM Setup and Operation
    2. 2.2 Pin Configuration of Opto-emulators
  7. 3Hardware Design Files
    1. 3.1 Schematics
    2. 3.2 PCB Layout and 3D Diagram
    3. 3.3 Bill of Materials
  8. 4Additional Information
    1. 4.1 Trademarks

3.3 Bill of Materials

Table 3-1 lists the bill of materials (BOM) for the ISOM8610DFGEVM.

Table 3-1 Bill of Materials
Item #DesignatorManufacturerDescription
J1, J2, J9, J10, J11, J12Samtec Connector Header Surface Mount 2 position 0.100" (2.54mm)
J3, J7, J8Sullins Connector Header, 2.54mm, 2x2, Gold, TH
J4, J6 Sullins Connector Header, 2.54mm, 4x2, Gold, TH
J5 Samtec Header, 2.54mm, 5x2, Gold, Black, TH
R1, R2, R7, R8, R23, R32Panasonic RES, 4.7 k, 5%, 0.125 W, AEC-Q200 Grade 0, 0805
R3, R5, R21Panasonic RES, 1.00 k, 1%, 0.25 W, 0805
R4, R6, R10, R25Ohmite 0 Ohms Jumper 0.245W Chip Resistor 0805 (2012 Metric) - Metal Element
TP0, TP1, TP2, TP3, TP4, TP5, TP6, TP7, TP9, TP17, TP18, TP21, TP28, TP31Keystone Test Point, Multipurpose, Red, TH
TP10, TP11, TP12, TP13, TP14, TP15, TP16, TP19, TP20, TP35, TP38 Keystone Test Point, Multipurpose, Black, TH
C1, C2, C3, C4, C10, C12Wurth Elektronik CAP, CERM, 15 pF, 50 V, +/- 5%, C0G/NP0, 0603
C5, C11, C13, C14 KEMET 0.1 µF ±10% 50V Ceramic Capacitor X7R 0805 (2012 Metric)
H1, H2, H3, H4, H5, H6, H7, H8, H9, H10, H11, H123MBumpon, Hemisphere, 0.25 X 0.075, Clear