SLAZ276AC October   2012  – May 2021 MSP430F5340

 

  1. 1Functional Advisories
  2. 2Preprogrammed Software Advisories
  3. 3Debug Only Advisories
  4. 4Fixed by Compiler Advisories
  5. 5Nomenclature, Package Symbolization, and Revision Identification
    1. 5.1 Device Nomenclature
    2. 5.2 Package Markings
      1.      RGZ48
    3. 5.3 Memory-Mapped Hardware Revision (TLV Structure)
  6. 6Advisory Descriptions
    1. 6.1  ADC25
    2. 6.2  ADC27
    3. 6.3  ADC29
    4. 6.4  ADC42
    5. 6.5  ADC69
    6. 6.6  BSL6
    7. 6.7  BSL7
    8. 6.8  COMP10
    9. 6.9  CPU21
    10. 6.10 CPU22
    11. 6.11 CPU23
    12. 6.12 CPU26
    13. 6.13 CPU27
    14. 6.14 CPU28
    15. 6.15 CPU29
    16. 6.16 CPU30
    17. 6.17 CPU31
    18. 6.18 CPU32
    19. 6.19 CPU33
    20. 6.20 CPU34
    21. 6.21 CPU35
    22. 6.22 CPU37
    23. 6.23 CPU39
    24. 6.24 CPU40
    25. 6.25 CPU47
    26. 6.26 DMA4
    27. 6.27 DMA7
    28. 6.28 DMA8
    29. 6.29 DMA10
    30. 6.30 EEM9
    31. 6.31 EEM11
    32. 6.32 EEM13
    33. 6.33 EEM14
    34. 6.34 EEM15
    35. 6.35 EEM16
    36. 6.36 EEM17
    37. 6.37 EEM19
    38. 6.38 EEM21
    39. 6.39 EEM23
    40. 6.40 FLASH33
    41. 6.41 FLASH34
    42. 6.42 FLASH35
    43. 6.43 FLASH37
    44. 6.44 JTAG20
    45. 6.45 JTAG26
    46. 6.46 JTAG27
    47. 6.47 MPY1
    48. 6.48 PMAP1
    49. 6.49 PMM9
    50. 6.50 PMM10
    51. 6.51 PMM11
    52. 6.52 PMM12
    53. 6.53 PMM14
    54. 6.54 PMM15
    55. 6.55 PMM17
    56. 6.56 PMM18
    57. 6.57 PMM20
    58. 6.58 PORT15
    59. 6.59 PORT16
    60. 6.60 PORT19
    61. 6.61 PORT24
    62. 6.62 RTC3
    63. 6.63 RTC6
    64. 6.64 SYS10
    65. 6.65 SYS12
    66. 6.66 SYS14
    67. 6.67 SYS16
    68. 6.68 TAB23
    69. 6.69 USCI26
    70. 6.70 USCI30
    71. 6.71 USCI31
    72. 6.72 USCI34
    73. 6.73 USCI35
    74. 6.74 USCI39
    75. 6.75 USCI40
    76. 6.76 WDG4
  7. 7Revision History

6.61 PORT24

PORT Module

Category

Functional

Function

Increased current consumption by internal floating pads

Description

For MSP430F534x devices in 48-pin RGZ package, the internal floating pads can cause increased current consumption in all operating modes. Those pads are not connected to external device pins and are not terminated automatically by the boot code.

Note: This erratum ONLY applies for MSP430F534x devices in 48-pin RGZ package.

Workaround

Add the following lines of code at the beginning of the application to terminate the floating pads and eliminate additional current consumption.

1. In Assembly:
    bis   #07F00h,&00204h ; Terminate unused P2
    bis   #000E0h,&00224h ; Terminate unused P4 and P3 pads
    bis   #0C140h,&00244h ; Terminate unused P6 and P5 pads
    bis   #0FFFFh,&00264h ; Terminate unused P8 and P7 pads

2. In C:

    #define INIT_MEMORY_ADDR 0x0204
  
    unsigned int *Init_Addr = ((unsigned int*)INIT_MEMORY_ADDR);
    *Init_Addr = 0x7F00;
    *(Init_Addr+0x10) = 0x00E0;
    *(Init_Addr+0x20) = 0xC140;
    *(Init_Addr+0x30) = 0x07FF;