SLDA021B March   2014  – February 2020 AM3892 , AM3894

 

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8.7.1 Preferred Method: Paste on PCB

If proper clearance is available around the perimeter of the device to accommodate a small metal or polyimide stencil, this method should be used, as it is more robust than printing solder paste directly onto the device’s balls.

Rework stencils for depositing solder paste onto the PCB should use the same recommended design as the SMT stencils: 0.35-mm (0.014") circular apertures on 125-μm (0.005") foils.