SLDA021B March   2014  – February 2020 AM3892 , AM3894

 

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3.4 Solder Paste Print Quality

Poor quality solder paste prints are the primary source of PCB assembly defects that require rework. The FCBGA rework process is highly dependent on operator skill level and presents a risk of permanent damage to the PCB. Therefore, care should be taken to optimize and monitor the stencil printing process to insure the best possible solder paste print quality.