SLDA060 March 2023 AM68 , AM68A , LP8733 , TPS62870 , TPS62871 , TPS62872 , TPS62873 , TPSM8287A10 , TPSM8287A12 , TPSM8287A15
This application note describes a low cost, small size, non-safety power design recommended for AM68x processor line as used on SK-AM68 Processor Starter Kit. A selection guide that reviews system tradeoffs and design benefits is included. The guide can assist in power design selection and feature set comparisons. Example power and control map diagrams are provided to accelerate the design process.
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The AM68x processor line provides highly flexible, real-time, and low latency processing for a broad range of industrial applications. These processors come in an array of variants with up to two Arm®Cortex® -A72 cores and up to six Arm®Cortex® -R5F cores each. TI has multiple power designs using different power management ICs (PMIC) to support an end product's desired feature set.
The LP8733x power design described below provides four Power Distribution Network (PDN) variants to supply AM68x processors according to a system's desired features. A selection guide has been created that outlines PDN features, optional functions, flexibility and design advantages for each PDN-6x variant. The power design highlights the value and flexibility of using a PMIC centric power design.
Selecting a AM68x power design begins with answering a few end product questions:
When a system’s desired features are determined, the PDN selection guide enables identification of a recommended power design. All recommended PDN designs provide:
A PDN design that groups MCU and Main supplies into common power rails can reduce a total number of power resources, BOM cost, PDN routing and PCB area. A grouped PDN supports Extended MCU processor operations that combines SoC Main and MCU processing resources. A grouped PDN will not provide a board design with FFI across power rails or MCU Island processing. One example of a grouped MCU and Main power solution is the J721S2 PDN-6x scheme that uses a LP87334E PMIC. Table 2-1 shows the PDN-6x base feature set supported by the base power resources and common across all variants. Table 2-2 shows all optional features available across the four PDN-6x (x = G, H, J, K) variants.
A PDN design that isolates MCU and Main supplies into independent power rails is needed to enable MCU Island processing and MCU Only low power mode. Independent MCU and Main power rails provides a board design with Freedom From Interference (FFI) across power rails for more robust systems. An isolated PDN typically requires more power resources that increases BOM cost, PDN routing and PCB area. For comparison, the J721S2 EVM SOM board (J721S2XSOMG01EVM) uses a J721S2 Dual TPS6594-Q1 and LP8764-Q1 PDN-0A scheme with isolated MCU and Main supplies. This J721S2 PDN-0A also supports up to ASIL-D functional safety capability, automotive qualified devices and a full feature set (base + all optional). A list of all optional features supported by J721S2 PDN-0A follows:
Base Features | PDN-6x (all variants) |
---|---|
Safety | None |
MCU and Main supplies | Grouped |
MCU operations | Extended MCU |
Power Resource PNs | LP87334E, TPS6287xZ0, TPS62850x |
SoC / Pwr Devices TJ ranges [C] | -40 to +105 / -40 to +125 |
SoC Clk [GHz] | < 2 |
SDRAM Memory EMIF / Bank Qty: SDRAM Memory Type (size, max rate): | 2 EMIFs / Dual Banks LPDDR4 (64 Gb/each, 4266 MTs) |
Boot (size) Flash Memory: Storage (size) Flash Memory: | OSPI (512Mb) or HyperFlash (1 Gb and 128 MB) eMMC (16GB) |
MCU I/O Signal Levels: Main I/O Signal Levels: | Dual 1.8/3.3 V Dual 1.8/3.3 V |
Optional Features | PDN-6G | PDN-6H SK-AM68 Processor Starter Kit | PDN-6J | PDN-6K |
---|---|---|---|---|
Low Power Modes | None | None | None | None |
Key Functions | HS SoC Efuse Prgm, UHS-I SD Card, USB2.0 interface | HS SoC Efuse Prgm, UHS-I SD Card | HS SoC Efuse Prgm | None |
Power Resource PNs | 2x TLV73318P, | TLV73318P, TPS61240, TLV7103318 | TLV73318P | |
Pwr IC Cost Ratio | 1.0 | 0.99 | 0.85 | 0.83 |
Pwr IC Area Ratio Actual Area [mm^2] | 1.0 68.2 | 0.87 59.0 | 0.82 55.7 | 0.68 46.5 |
The LP87334E is an integrated power management IC (PMIC) device optimized for AM68x processors. LP87334E simplifies the design process, reduces time to market and enables direct implementation of recommended power solutions. Table 3-1 provides an overview of the basic features.
Features | LP8733x |
---|---|
Operational Ambient Temperature Range | -40 to +125 C |
Input Voltage Range | 2.8 V to 5.5 V |
Total Number of Regulators | 4 |
DC-DC step-down converters | qty = 2, max current = 3 A, output voltage = 0.7 - 3.36 V, remote voltage sense |
LDOs | qty = 2, max current = 0.3 A, output voltage = 0.8 - 3.3V |
Additional Features |
|
Table 3-2 shows the regulator output voltage with both startup and shutdown sequencing delays for LP87334E. For more information on operation and specifications of this device, please see the LP8733x data sheet.
PMIC | LP87334E | |
---|---|---|
Regulator Settings | Output Voltage | Startup / Shutdown Delay |
Buck0 | 0.85 V | 3 ms / 0.5 ms |
Buck1 | 1.1 V | 3 ms / 0.5 ms |
LDO0 | 0.8 V | 1 ms / 1 ms |
LDO1 | 1.8 V | 0 ms / 3 ms |
GPO0 | PP ref to VANA (1) | 1 ms / 1 ms |
GPO2 | OD with Rpu(1) | 11 ms / 0 ms |