SLES242H December   2009  – July 2024 DRV8412

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Pin Configuration and Functions
  6. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Package Heat Dissipation Ratings
    6. 5.6 Package Power Deratings (DRV8412) #GUID-2A6DB468-D895-404F-A2E6-05A442AE2834/SLES2429141
    7. 5.7 Electrical Characteristics
    8. 5.8 Typical Characteristics
  7. 6Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Error Reporting
      2. 6.3.2 Device Protection System
        1. 6.3.2.1 Bootstrap Capacitor Undervoltage Protection
        2. 6.3.2.2 Overcurrent (OC) Protection
        3. 6.3.2.3 Overtemperature Protection
        4. 6.3.2.4 Undervoltage Protection (UVP) and Power-On Reset (POR)
      3. 6.3.3 Device Reset
    4. 6.4 Device Functional Modes
  8.   Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 Full Bridge Mode Operation
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
          1. 7.2.1.2.1 Motor Voltage
          2. 7.2.1.2.2 Current Requirement of 12V Power Supply
          3. 7.2.1.2.3 Voltage of Decoupling Capacitor
          4. 7.2.1.2.4 Overcurrent Threshold
          5. 7.2.1.2.5 Sense Resistor
        3. 7.2.1.3 Application Curves
      2. 7.2.2 Parallel Full Bridge Mode Operation
      3. 7.2.3 Stepper Motor Operation
      4. 7.2.4 TEC Driver
      5. 7.2.5 LED Lighting Driver
    3. 7.3 Power Supply Recommendations
      1. 7.3.1 Bulk Capacitance
      2. 7.3.2 Power Supplies
      3. 7.3.3 System Power-Up and Power-Down Sequence
        1. 7.3.3.1 Powering Up
        2. 7.3.3.2 Powering Down
      4. 7.3.4 System Design Recommendations
        1. 7.3.4.1 VREG Pin
        2. 7.3.4.2 VDD Pin
        3. 7.3.4.3 OTW Pin
        4. 7.3.4.4 Mode Select Pin
        5. 7.3.4.5 Parallel Mode Operation
        6. 7.3.4.6 TEC Driver Application
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
        1. 7.4.1.1 PCB Material Recommendation
        2. 7.4.1.2 Ground Plane
        3. 7.4.1.3 Decoupling Capacitor
        4. 7.4.1.4 AGND
      2. 7.4.2 Layout Example
        1. 7.4.2.1 Current Shunt Resistor
      3. 7.4.3 Thermal Considerations
        1. 7.4.3.1 DRV8412 Thermal Via Design Recommendation
  9. 7Device and Documentation Support
    1. 7.1 Receiving Notification of Documentation Updates
    2. 7.2 Support Resources
    3. 7.3 Trademarks
    4. 7.4 Electrostatic Discharge Caution
    5. 7.5 Glossary
  10. 8Revision History
  11. 9Mechanical, Packaging, and Orderable Information

1 Features

  • High-efficiency power stage (up to 97%) with low RDS(on) MOSFETs (110mΩ at TJ = 25°C)
  • Operating supply voltage up to 52V
  • DRV8412 (Power pad down): up to 2 × 3A continuous output current (2 × 6A peak) in dual full-bridge mode or 6A continuous current in parallel mode (12A peak)
  • DRV8432 (Power pad up): up to 2 × 7A continuous output current (2 × 12A peak) in dual full-bridge mode or 14A continuous current in parallel mode (24A peak)
  • PWM operating frequency up to 500kHz
  • Integrated self-protection circuits including undervoltage, overtemperature, overload, and short circuit
  • Programmable cycle-by-cycle current limit protection
  • Independent supply and ground pins for each half bridge
  • Intelligent gate drive and cross conduction prevention
  • No external snubber or schottky diode is required