SLES242H December   2009  – July 2024 DRV8412

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Pin Configuration and Functions
  6. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Package Heat Dissipation Ratings
    6. 5.6 Package Power Deratings (DRV8412) #GUID-2A6DB468-D895-404F-A2E6-05A442AE2834/SLES2429141
    7. 5.7 Electrical Characteristics
    8. 5.8 Typical Characteristics
  7. 6Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Error Reporting
      2. 6.3.2 Device Protection System
        1. 6.3.2.1 Bootstrap Capacitor Undervoltage Protection
        2. 6.3.2.2 Overcurrent (OC) Protection
        3. 6.3.2.3 Overtemperature Protection
        4. 6.3.2.4 Undervoltage Protection (UVP) and Power-On Reset (POR)
      3. 6.3.3 Device Reset
    4. 6.4 Device Functional Modes
  8.   Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 Full Bridge Mode Operation
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
          1. 7.2.1.2.1 Motor Voltage
          2. 7.2.1.2.2 Current Requirement of 12V Power Supply
          3. 7.2.1.2.3 Voltage of Decoupling Capacitor
          4. 7.2.1.2.4 Overcurrent Threshold
          5. 7.2.1.2.5 Sense Resistor
        3. 7.2.1.3 Application Curves
      2. 7.2.2 Parallel Full Bridge Mode Operation
      3. 7.2.3 Stepper Motor Operation
      4. 7.2.4 TEC Driver
      5. 7.2.5 LED Lighting Driver
    3. 7.3 Power Supply Recommendations
      1. 7.3.1 Bulk Capacitance
      2. 7.3.2 Power Supplies
      3. 7.3.3 System Power-Up and Power-Down Sequence
        1. 7.3.3.1 Powering Up
        2. 7.3.3.2 Powering Down
      4. 7.3.4 System Design Recommendations
        1. 7.3.4.1 VREG Pin
        2. 7.3.4.2 VDD Pin
        3. 7.3.4.3 OTW Pin
        4. 7.3.4.4 Mode Select Pin
        5. 7.3.4.5 Parallel Mode Operation
        6. 7.3.4.6 TEC Driver Application
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
        1. 7.4.1.1 PCB Material Recommendation
        2. 7.4.1.2 Ground Plane
        3. 7.4.1.3 Decoupling Capacitor
        4. 7.4.1.4 AGND
      2. 7.4.2 Layout Example
        1. 7.4.2.1 Current Shunt Resistor
      3. 7.4.3 Thermal Considerations
        1. 7.4.3.1 DRV8412 Thermal Via Design Recommendation
  9. 7Device and Documentation Support
    1. 7.1 Receiving Notification of Documentation Updates
    2. 7.2 Support Resources
    3. 7.3 Trademarks
    4. 7.4 Electrostatic Discharge Caution
    5. 7.5 Glossary
  10. 8Revision History
  11. 9Mechanical, Packaging, and Orderable Information

5.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MINNOMMAXUNIT
PVDD_XHalf bridge X (A, B, C, or D) DC supply voltage05052.5V
GVDD_XSupply for logic regulators and gate-drive circuitry10.81213.2
VDDDigital regulator supply voltage10.81213.2
IO_PULSEPulsed peak current per output pin (could be limited by thermal)15A
IOContinuous current per output pin (DRV8432)9mA
FSWPWM switching frequency500kHz
ROCP_CBCOC programming resistor range in cycle-by-cycle current limit modes24200kΩ
ROCP_OCLOC programming resistor range in OC latching shutdown modes22200
CBSTBootstrap capacitor range33220nF
tON_MINMinimum PWM pulse duration, low side, for charging the Bootstrap capacitor50ns
TAOperating ambient temperature–4085°C