SLIU002A September   2008  – October 2022 TPIC74100-Q1

 

  1.   Trademarks
  2. 1Introduction
  3. 2Setup
    1. 2.1 Input/Output Connector Description
    2. 2.2 Setup
    3. 2.3 Operation
  4. 3Board Layout
  5. 4Schematic
  6. 5Revision History

3 Board Layout

Figure 6, Figure 7, Figure 8, and Figure 9 show the board layout for the TPIC74100EVM PWB. The EVM offers resistors, capacitors, and jumpers to program the switch pin slew rate and regulator turn-on Delay. Jumpers are also provided to enable the device and to enable the low-power mode option.

The TPIC74100 offers high efficiency but does dissipate power. The PowerPAD™ package offers an exposed thermal pad to enhance thermal performance. This must be soldered to the copper landing on the PCB for optimal performance. The PCB provides 1-oz copper planes on the top and bottom to dissipate heat.

GUID-20220831-SS0I-561P-3XHG-FW6HWKQ3HNSM-low.gif Figure 3-1 Top Assembly Layer
GUID-20220831-SS0I-QMRB-L7MW-VL3RGPB5ZS64-low.gif Figure 3-2 Bottom Assembly Layer (viewed from bottom)
GUID-20220831-SS0I-CW1F-NSNK-TNDW86KJWCQD-low.gif Figure 3-3 Top Layer Routing
GUID-20220831-SS0I-91W0-2GST-PZKD4ZGZTG2S-low.gif Figure 3-4 Bottom Layer Routing (viewed from bottom)