SLLA626 September   2023 HD3SS460

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Introduction
  5. 2Migrating from TI HD3SS460 to TMUXHS4446
    1. 2.1 Pinout Differences
    2. 2.2 Package Differences
    3. 2.3 Protocol Differences
  6. 3PCB Layout Recommendations
  7. 4Summary
  8. 5References

2.2 Package Differences

Table 2-3 includes a comparison between the packages HD3SS460 and TMUXHS4446.

Table 2-3 Package Differences
Part numberPackageBody size (NOM)
HD3SS460QFN (RHR) (28)3.50 mm x 5.50 mm
QFN (RNH) (30)2.50 mm x 4.50 mm
TMUXHS4446QFN (RET) (40)3.0 mm x 6.0 mm