SLLA626 September   2023 HD3SS460

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Introduction
  5. 2Migrating from TI HD3SS460 to TMUXHS4446
    1. 2.1 Pinout Differences
    2. 2.2 Package Differences
    3. 2.3 Protocol Differences
  6. 3PCB Layout Recommendations
  7. 4Summary
  8. 5References

1 Introduction

HD3SS460 is a 4:6 passive mux that bi-directionally routes high-speed signals. HD3SS460 supports USB Type-C and Alternative Mode signals, as well any high-speed interface applications with common mode voltage range of 0-2 V and differential signaling with differential amplitude up to 1800 mVpp. Typical applications for HD3SS460 include PC and notebooks, tablets, docking stations, monitors, and more.

Due to increasing data rates and higher bandwidth requirements, in the spring of 2024, TI released TMUXHS4446, an upgrade to HD3SS460 supporting two times the bandwidth, a wider temperature range, lower power consumption, and stronger supply continuity. In addition, while the only control interface of HD3SS460 is GPIO, TMUXHS4446 is controllable through either GPIO or I2C.

To understand the differences between HD3SS460 and TMUXHS4446, including both improvements and additions, see Table 1-1.

Table 1-1 Parameter Comparison
DeviceTMUXHS4446HD3SS460
Data Rate Support10 Gbps5 Gbps
-3dB BW (relative to DC)10 GHz4.2 GHz
IL at 5 Ghz-1.8dB5 GHz not supported
RL at 5 GHz-15dB5 GHz not supported
Xtalk at 5 Ghz-45dB5 GHz not supported
Off Isolation at 5 GHz-21dB5 GHz not supported
Active power consumption340 µA600uA
Shutdown power consumption0.7 uA1uA
Supply voltage3.3 V3.3 V
IO voltage support1.8 or 3.3V3.3 V
Control interfaceI2C or GPIOGPIO
Temp support-40 to 105°C-40 to 85°C
Package3x6mm2.5x4.5mm
Die size0.8x2.4mm target (LBC9)1.14x1.68 mm (Bicom3ZL)

Multisource design

YesNo