SLLA643 August   2024 MCF8315C , MCF8315C-Q1 , MCF8316C-Q1

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Introduction
  5. 2Power Pin Design Recommendations
    1. 2.1 VM
    2. 2.2 Charge Pump: CPH, CPL, CP
    3. 2.3 Buck Converter: FB_BK, SW_BK, GND_BK
    4. 2.4 AVDD
    5. 2.5 DVDD
    6. 2.6 PGND, AGND, DGND
    7. 2.7 Thermal Pad
  6. 3MCF831xC Buck Regulator Overview
    1. 3.1 Buck Regulator Mode of Operation
    2. 3.2 Buck Regulator Output Voltage
    3. 3.3 Buck Power Sequencing
    4. 3.4 Buck Inductor Selection
    5. 3.5 MCF831xC Operation Without Buck Regulator
  7. 4MCF831xC IO Pins Design Recommendations
    1. 4.1 SPEED Pin
    2. 4.2 BRAKE, DIR, DRVOFF pins
    3. 4.3 EXT_CLK, EXT_WD
    4. 4.4 ALARM
    5. 4.5 DACOUT1, DACOUT2
    6. 4.6 SDA, SCL
    7. 4.7 nFAULT and FG pin
  8. 5MCF831xC PCB Schematic and Layout Recommendations
    1. 5.1 Single Ground Plane
    2. 5.2 Single Ground with AVDD Shorted to FB_BK
    3. 5.3 Two Grounds
  9. 6Summary
  10. 7References

3.3 Buck Power Sequencing

MCF831xC has an option of powering the AVDD LDO using the buck regulator instead of VM to reduce the power losses inside the IC and improve thermal performance. This option can be enabled by setting BUCK_PS_DIS to 0b as shown in Figure 3-3. Buck power sequencing is available only when the buck regulator output voltage is set to 5V or 5.7V (BUCK_SEL = 01b or 11b).

Buck Regulator Power Sequencing Figure 3-3 Buck Regulator Power Sequencing