SLLA643
August 2024
MCF8315C
,
MCF8315C-Q1
,
MCF8316C-Q1
1
Abstract
Trademarks
1
Introduction
2
Power Pin Design Recommendations
2.1
VM
2.2
Charge Pump: CPH, CPL, CP
2.3
Buck Converter: FB_BK, SW_BK, GND_BK
2.4
AVDD
2.5
DVDD
2.6
PGND, AGND, DGND
2.7
Thermal Pad
3
MCF831xC Buck Regulator Overview
3.1
Buck Regulator Mode of Operation
3.2
Buck Regulator Output Voltage
3.3
Buck Power Sequencing
3.4
Buck Inductor Selection
3.5
MCF831xC Operation Without Buck Regulator
4
MCF831xC IO Pins Design Recommendations
4.1
SPEED Pin
4.2
BRAKE, DIR, DRVOFF pins
4.3
EXT_CLK, EXT_WD
4.4
ALARM
4.5
DACOUT1, DACOUT2
4.6
SDA, SCL
4.7
nFAULT and FG pin
5
MCF831xC PCB Schematic and Layout Recommendations
5.1
Single Ground Plane
5.2
Single Ground with AVDD Shorted to FB_BK
5.3
Two Grounds
6
Summary
7
References
7
References
Texas Instruments,
Implications of Slow or Floating CMOS Inputs,
application note.
Texas Instruments,
I2C Bus Pullup Resistor Calculation,
application note.
Mouser,
Selecting the Optimal Inductor for Power Converter Applications,
white paper.
Coil Craft,
Selecting the Best Inductor for Your DC-DC Converter,
application note.
MuRata,
The voltage characteristics of electrostatic capacitance,
capacitor guide article.
Murata,
What is the temperature characteristics of ceramic capacitors,
capacitor guide article.