SLLA643 August   2024 MCF8315C , MCF8315C-Q1 , MCF8316C-Q1

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Introduction
  5. 2Power Pin Design Recommendations
    1. 2.1 VM
    2. 2.2 Charge Pump: CPH, CPL, CP
    3. 2.3 Buck Converter: FB_BK, SW_BK, GND_BK
    4. 2.4 AVDD
    5. 2.5 DVDD
    6. 2.6 PGND, AGND, DGND
    7. 2.7 Thermal Pad
  6. 3MCF831xC Buck Regulator Overview
    1. 3.1 Buck Regulator Mode of Operation
    2. 3.2 Buck Regulator Output Voltage
    3. 3.3 Buck Power Sequencing
    4. 3.4 Buck Inductor Selection
    5. 3.5 MCF831xC Operation Without Buck Regulator
  7. 4MCF831xC IO Pins Design Recommendations
    1. 4.1 SPEED Pin
    2. 4.2 BRAKE, DIR, DRVOFF pins
    3. 4.3 EXT_CLK, EXT_WD
    4. 4.4 ALARM
    5. 4.5 DACOUT1, DACOUT2
    6. 4.6 SDA, SCL
    7. 4.7 nFAULT and FG pin
  8. 5MCF831xC PCB Schematic and Layout Recommendations
    1. 5.1 Single Ground Plane
    2. 5.2 Single Ground with AVDD Shorted to FB_BK
    3. 5.3 Two Grounds
  9. 6Summary
  10. 7References

Abstract

PCB design for BLDC motor control applications is an involved process that depends on various factors like cost, form factor, operating conditions, reliability, efficiency, and so on. This application note aims to minimize the PCB design time by providing recommendations for designing PCBs for motor control applications using devices belonging to the MCF831xC family of devices.

Note: MCF831xC refers to TI’s latest Sensorless FOC based integrated FET BLDC drivers including MCF8316C-Q1, MCF8315C-Q1, and MCF8315C.