10 Revision History
Changes from Revision B (July 2021) to Revision C (December 2024)
- Changed the Device Information table to the Package
Information tableGo
- Added the SOT-23-THN (DYY) package to the data
sheetGo
- Added Note 2 to the ESD Ratings, IEC Specifications
Go
Changes from Revision A (December 2020) to Revision B (July 2021)
- Changed the Applications listGo
- Changed the table note for the ESD Ratings, IEC Specifications to make it applicable to all packagesGo
- Changed the thermal information for PW and DB packagesGo
Changes from Revision * (June 2007) to Revision A (December 2020)
- Added ESD Ratings, ESD Ratings, IEC Specifications tables, Thermal
Information table, Typical
Characteristics section, Detailed
Description section, Application and
Implementation section, Power Supply
Recommendations section, Layout
section, Device and Documentation Support
section, and Mechanical, Packaging, and
Orderable Information sectionGo
- Deleted Ordering Information table.Go
- Added the RGT (VQFN-16) package pinout Go
- Added data rate and
tsk(p) rows for the RGT package in Driver Section
Switching Characteristics table Go
- Added tpLH, tpHL, tsk(p) rows for the RGT
package in Reciever Section Switching Characteristics table Go