SLLSEM3H November 2014 – May 2024 ISO7841
PRODUCTION DATA
ISO7841 | UNIT | ||||
---|---|---|---|---|---|
THERMAL METRIC(1) | DW (SOIC) | DWW (SOIC) | |||
16 Pins | 16 Pins | ||||
RθJA | Junction-to-ambient thermal resistance | 78.9 | 78.9 | °C/W | |
RθJC(top) | Junction-to-case(top) thermal resistance | 41.6 | 41.1 | °C/W | |
RθJB | Junction-to-board thermal resistance | 43.6 | 49.5 | °C/W | |
ψJT | Junction-to-top characterization parameter | 15.5 | 15.2 | °C/W | |
ψJB | Junction-to-board characterization parameter | 43.1 | 48.8 | °C/W | |
RθJC(bottom) | Junction-to-case(bottom) thermal resistance | N/A | N/A | °C/W |