SLLSEU0G November   2016  – October 2024 ISO7740-Q1 , ISO7741-Q1 , ISO7742-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Power Ratings
    6. 5.6  Insulation Specifications
    7. 5.7  Safety-Related Certifications
    8. 5.8  Safety Limiting Values
    9. 5.9  Electrical Characteristics—5-V Supply
    10. 5.10 Supply Current Characteristics—5-V Supply
    11. 5.11 Electrical Characteristics—3.3-V Supply
    12. 5.12 Supply Current Characteristics—3.3-V Supply
    13. 5.13 Electrical Characteristics—2.5-V Supply 
    14. 5.14 Supply Current Characteristics—2.5-V Supply
    15. 5.15 Switching Characteristics—5-V Supply
    16. 5.16 Switching Characteristics—3.3-V Supply
    17. 5.17 Switching Characteristics—2.5-V Supply
    18. 5.18 Insulation Characteristics Curves
    19. 5.19 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Electromagnetic Compatibility (EMC) Considerations
    4. 7.4 Device Functional Modes
      1. 7.4.1 Device I/O Schematics
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
        1. 8.2.3.1 Insulation Lifetime
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 PCB Material
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Related Links
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

5.8 Safety Limiting Values

Safety limiting(1) intends to minimize potential damage to the isolation barrier upon failure of input or output circuitry. A failure of the I/O can allow low resistance to ground or the supply and, without current limiting, dissipate sufficient power to overheat the die and damage the isolation barrier potentially leading to secondary system failures.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
DWW-16 PACKAGE
IS Safety input, output, or supply current RθJA = 58.3 °C/W, VI = 5.5 V, TJ = 150°C, TA = 25°C, see Figure 5-1 390 mA
RθJA = 58.3 °C/W, VI = 3.6 V, TJ = 150°C, TA = 25°C, see Figure 5-1 596 mA
RθJA = 58.3 °C/W, VI = 2.75 V, TJ = 150°C, TA = 25°C, see Figure 5-1 780 mA
PS Safety input, output, or total power RθJA = 58.3 °C/W, TJ = 150°C, TA = 25°C, see Figure 5-4 2144 mW
TS Maximum safety temperature 150 °C
DW-16 PACKAGE
IS Safety input, output, or supply current RθJA =83.4°C/W, VI = 5.5 V, TJ = 150°C, TA = 25°C, see Figure 5-2 273 mA
RθJA = 83.4°C/W, VI = 3.6 V, TJ = 150°C, TA = 25°C, see Figure 5-2 416
RθJA = 83.4°C/W, VI = 2.75 V, TJ = 150°C, TA = 25°C, see Figure 5-2 545
PS Safety input, output, or total power RθJA = 83.4°C/W, TJ = 150°C, TA = 25°C, see Figure 5-5 1499 mW
TS Maximum safety temperature 150 °C
DBQ-16 PACKAGE
IS Safety input, output, or supply current RθJA =109°C/W, VI = 5.5 V, TJ = 150°C, TA = 25°C, see Figure 5-3 209 mA
RθJA = 109°C/W, VI = 3.6 V, TJ = 150°C, TA = 25°C, see Figure 5-3 319
RθJA = 109°C/W, VI = 2.75 V, TJ = 150°C, TA = 25°C, see Figure 5-3 417
PS Safety input, output, or total power RθJA = 109°C/W, TJ = 150°C, TA = 25°C, see Figure 5-6 1147 mW
TS Maximum safety temperature 150 °C
(1) The maximum safety temperature, TS, has the same value as the maximum junction temperature, TJ, specified for the device. The IS and PS parameters represent the safety current and safety power respectively. The maximum limits of IS and PS should not be exceeded. These limits vary with the ambient temperature, TA. 

The junction-to-air thermal resistance, RθJA, in Section 5.4 is that of a device installed on a high-K test board for leaded surface-mount packages. Use these equations to calculate the value for each parameter:
TJ = TA + RθJA × P, where P is the power dissipated in the device.
TJ(max) = TS = TA + RθJA × PS, where TJ(max) is the maximum allowed junction temperature.
PS = IS × VI, where VI is the maximum input voltage.