SLLSEV7E August   2016  – March 2023 TUSB546-DCI

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Supply Characteristics
    6. 6.6  DC Electrical Characteristics
    7. 6.7  AC Electrical Characteristics
    8. 6.8  Timing Requirements
    9. 6.9  Switching Characteristics
    10. 6.10 Typical Characteristics
      1.      Parameter Measurement Information
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 USB 3.1
      2. 7.3.2 DisplayPort
      3. 7.3.3 4-Level Inputs
      4. 7.3.4 Receiver Linear Equalization
    4. 7.4 Device Functional Modes
      1. 7.4.1 Device Configuration in GPIO Mode
      2. 7.4.2 28
      3. 7.4.3 Device Configuration In I2C Mode
      4. 7.4.4 DisplayPort Mode
      5. 7.4.5 Linear EQ Configuration
      6. 7.4.6 USB3.1 Modes
      7. 7.4.7 Operation Timing – Power Up
    5. 7.5 Programming
    6. 7.6 Register Maps
      1. 7.6.1 General Register (address = 0x0A) [reset = 00000001]
      2. 7.6.2 DisplayPort Control/Status Registers (address = 0x10) [reset = 00000000]
      3. 7.6.3 DisplayPort Control/Status Registers (address = 0x11) [reset = 00000000]
      4. 7.6.4 DisplayPort Control/Status Registers (address = 0x12) [reset = 00000000]
      5. 7.6.5 DisplayPort Control/Status Registers (address = 0x13) [reset = 00000000]
      6. 7.6.6 USB3.1 Control/Status Registers (address = 0x20) [reset = 00000000]
      7. 7.6.7 USB3.1 Control/Status Registers (address = 0x21) [reset = 00000000]
      8. 7.6.8 USB3.1 Control/Status Registers (address = 0x22) [reset = 00000100]
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 System Examples
      1. 8.3.1 USB 3.1 Only
      2. 8.3.2 USB 3.1 and 2 Lanes of DisplayPort
      3. 8.3.3 DisplayPort Only
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
  9. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  10. 10Mechanical, Packaging, and Orderable Information

9.4 Electrostatic Discharge Caution

GUID-D6F43A01-4379-4BA1-8019-E75693455CED-low.gif This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.