SLLSEZ1C September   2017  – May 2019 TDP142

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematics
      2.      Display
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Supply Characteristics
    6. 6.6  DC Electrical Characteristics
    7. 6.7  AC Electrical Characteristics
    8. 6.8  Timing Requirements
    9. 6.9  Switching Characteristics
    10. 6.10 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 DisplayPort
      2. 8.3.2 4-level Inputs
      3. 8.3.3 Receiver Linear Equalization
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device Configuration in GPIO Mode
      2. 8.4.2 Device Configuration In I2C Mode
      3. 8.4.3 Linear EQ Configuration
      4. 8.4.4 Operation Timing – Power Up
    5. 8.5 Programming
    6. 8.6 Register Maps
      1. 8.6.1 General Register (address = 0x0A) [reset = 00000001]
        1. Table 6. General Registers
      2. 8.6.2 DisplayPort Control/Status Registers (address = 0x10) [reset = 00000000]
        1. Table 7. DisplayPort Control/Status Registers (0x10)
      3. 8.6.3 DisplayPort Control/Status Registers (address = 0x11) [reset = 00000000]
        1. Table 8. DisplayPort Control/Status Registers (0x11)
      4. 8.6.4 DisplayPort Control/Status Registers (address = 0x12) [reset = 00000000]
        1. Table 9. DisplayPort Control/Status Registers (0x12)
      5. 8.6.5 DisplayPort Control/Status Registers (address = 0x13) [reset = 00000000]
        1. Table 10. DisplayPort Control/Status Registers (0x13)
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Source Application Implementation
        1. 9.2.1.1 Design Requirement
        2. 9.2.1.2 Detail Design Procedure
      2. 9.2.2 Sink Application Implementation
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Related Links
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

9.2.2.2 Detailed Design Procedure

The design procedure for Sink application is listed as follows:

  • Determine the loss profile on the DP input (C) and output (D) channels and cables. See Figure 20 for 6 mil trace insertion loss.
  • Based upon the loss profile, determine the optimal configuration for the TDP142, to pass electrical compliance.
  • See Figure 19 for information of Sink application on using the AC coupling capacitors, control pin resistors, and for recommended decouple capacitors from VCC pins to ground.
    • AUX: AUXP has a 1 MΩ pull-up resistor and AUXN should have a 1 MΩ pull-down resistor. Theses 1 MΩ resistors must be on the TDP142 side of the 100 nF capacitors.
    • HPDIN: The HPD signal should be routed to either pin 23 or pin 32 based on the GPIO/I2C mode. In that way, the TDP142 will always be able to conserve power when a source is not connected.

      • Table 14. HPD GPIO/I2C Selection

      MODE HPD
      GPIO (I2C_EN = 0) Pin 32
      I2C (I2C_EN != 0) Pin 23

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  • Configure the TDP142 using the GPIO terminals or the I2C interface:
    • GPIO – Using the terminals DPEQ0 and DPEQ1.
    • It is recommended to start a higher equalization value like 13 dB and 15 dB first and adjust the value if necessary.
    • I2C - Refer to the I2C Register Maps and the Programming section for a detail configuration procedures.
  • The thermal pad must be connected to ground.