SLLSF31A May   2021  – December 2021 TCAN1162-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configurations and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 ESD Ratings IEC Specification
    4. 7.4 Recomended Operating Conditions
    5. 7.5 Thermal Information
    6. 7.6 Power Supply Characteristics
    7. 7.7 Electrical Characteristics
    8. 7.8 Switching Characteristics
    9. 7.9 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  VSUP Pin
      2. 9.3.2  VFLT Pin
      3. 9.3.3  Digital Inputs and Outputs
        1. 9.3.3.1 TXD Pin
        2. 9.3.3.2 RXD Pin
        3. 9.3.3.3 TS Pin
      4. 9.3.4  Digital Control and Timing
      5. 9.3.5  VIO Pin
      6. 9.3.6  GND
      7. 9.3.7  INH Pin
      8. 9.3.8  WAKE Pin
      9. 9.3.9  CAN Bus Pins
      10. 9.3.10 Local Faults
        1. 9.3.10.1 TXD Dominant Timeout (TXD DTO)
        2. 9.3.10.2 Thermal Shutdown (TSD)
        3. 9.3.10.3 Under/Over Voltage Lockout
        4. 9.3.10.4 Unpowered Devices
        5. 9.3.10.5 Floating Terminals
        6. 9.3.10.6 CAN Bus Short Circuit Current Limiting
        7. 9.3.10.7 Sleep Wake Error Timer
    4. 9.4 Device Functional Modes
      1. 9.4.1 Operating Mode Description
        1. 9.4.1.1 Normal Mode
        2. 9.4.1.2 Standby Mode
        3. 9.4.1.3 Sleep Mode
          1. 9.4.1.3.1 Remote Wake Request via Wake-Up Pattern (WUP)
          2. 9.4.1.3.2 Local Wake-Up (LWU) via WAKE Input Terminal
        4. 9.4.1.4 Fail-safe Mode
      2. 9.4.2 CAN Transceiver
        1. 9.4.2.1 CAN Transceiver Operation
        2. 9.4.2.2 CAN Transceiver Modes
          1. 9.4.2.2.1 CAN Off Mode
          2. 9.4.2.2.2 CAN Autonomous: Inactive and Active
          3. 9.4.2.2.3 CAN Active
        3. 9.4.2.3 Driver and Receiver Function Tables
        4. 9.4.2.4 CAN Bus States
  10. 10Application Information
    1. 10.1 Application Information Disclaimer
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
        1. 10.2.1.1 Bus Loading, Length and Number of Nodes
      2. 10.2.2 Detailed Design Procedures
        1. 10.2.2.1 CAN Termination
    3. 10.3 Application Curves
  11. 11Power Supply Requirements
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Receiving Notification of Documentation Updates
    3. 13.3 Support Resources
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

7.1 Absolute Maximum Ratings

over operating virtual junction temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VSUP Supply voltage range –0.3 42 V
VFLT Transceiver supply voltage -0.3 6 V
VIO IO level shifting voltage range –0.3 6 V
VBUS CAN bus IO voltage range (CANH, CANL) –58 58 V
VWAKE WAKE input pin voltage range –18 42 and VI ≤ VSUP + 0.3 V
VINH INH output pin voltage range –0.3 42 and VO ≤ VSUP + 0.3 V
V(Logic_Input) Logic input terminal voltage range –0.3 6 V
V(Logic_Output) Logic output terminal voltage range –0.3 6 V
IO(LOGIC) Logic output current 8 mA
IO(INH) INH output current 6 mA
IO(WAKE) Wake current if due to ground shifts V(WAKE) ≤ V(GND) – 0.3 V, thus the current into WAKE must be limited via an external serial resistor 3 mA
TJ Operating virtual junction temperature range –40 150 °C
TSTG Storage temperature -65 165 °C
(1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.