SLLSF47D February   2018  – April 2024 TUSB1044

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Timing Requirements
    8. 5.8 Typical Characteristics
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 USB 3.1
      2. 6.3.2 DisplayPort
      3. 6.3.3 4-Level Inputs
      4. 6.3.4 Receiver Linear Equalization
    4. 6.4 Device Functional Modes
      1. 6.4.1 Device Configuration in GPIO mode
      2. 6.4.2 Device Configuration in I2C Mode
      3. 6.4.3 DisplayPort Mode
      4. 6.4.4 Custom Alternate Mode
      5. 6.4.5 Linear EQ Configuration
      6. 6.4.6 Adjustable VOD Linear Range and DC Gain
      7. 6.4.7 USB3.1 Modes
    5. 6.5 Programming
      1. 6.5.1 Use The Following Procedure to Write to TUSB1044 I2C Registers:
      2. 6.5.2 Use The Following Procedure to Read the TUSB1044 I2C Registers:
      3. 6.5.3 Use The Following Procedure for Setting a Starting Sub-Address for I2C Reads:
    6. 6.6 Register Maps
      1. 6.6.1 TUSB1044 Registers
  8. Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curve
    3. 7.3 System Examples
      1. 7.3.1 USB 3.1 only (USB/DP Alternate Mode)
      2. 7.3.2 USB3.1 and 2 lanes of DisplayPort
      3. 7.3.3 DisplayPort Only
      4. 7.3.4 USB 3.1 only (USB/Custom Alternate Mode)
      5. 7.3.5 USB3.1 and 1 Lane of Custom Alt Mode
      6. 7.3.6 USB3.1 and 2 Lane of Custom Alt Mode
      7. 7.3.7 USB3.1 and 4 Lane of Custom Alt Mode
    4. 7.4 Power Supply Recommendations
    5. 7.5 Layout
      1. 7.5.1 Layout Guidelines
      2. 7.5.2 Layout Example
  9. Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Electrostatic Discharge Caution

GUID-D6F43A01-4379-4BA1-8019-E75693455CED-low.gif This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.