SLLSF54D October   2017  – March 2020 ISO7041

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Application Schematic
      2.      Data Rate vs Power Consumption at 3.3 V
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Power Ratings
    6. 7.6  Insulation Specifications
    7. 7.7  Safety-Related Certifications
    8. 7.8  Safety Limiting Values
    9. 7.9  Electrical Characteristics 5V Supply
    10. 7.10 Supply Current Characteristics 5V Supply
    11. 7.11 Electrical Characteristics 3.3V Supply
    12. 7.12 Supply Current Characteristics 3.3V Supply
    13. 7.13 Electrical Characteristics 2.5V Supply
    14. 7.14 Supply Current Characteristics 2.5V Supply
    15. 7.15 Electrical Characteristics 1.8V Supply
    16. 7.16 Supply Current Characteristics 1.8V Supply
    17. 7.17 Switching Characteristics
    18. 7.18 Insulation Characteristics Curves
    19. 7.19 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Refresh Enable
      2. 9.3.2 Electromagnetic Compatibility (EMC) Considerations
    4. 9.4 Device Functional Modes
      1. 9.4.1 Device I/O Schematics
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Insulation Lifetime
      2. 10.1.2 Intrinsic Safety
        1. 10.1.2.1 Schedule of Limitations
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 PCB Material
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Receiving Notification of Documentation Updates
    3. 13.3 Community Resource
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

7.4 Thermal Information

THERMAL METRIC(1) ISO7041 UNIT
DBQ (SOIC)
16 PINS
RθJA Junction-to-ambient thermal resistance 87.0 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 33.3 °C/W
RθJB Junction-to-board thermal resistance 49.1 °C/W
ψJT Junction-to-top characterization parameter 8.4 °C/W
ψJB Junction-to-board characterization parameter 48.5 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance — °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.