SLLSFY8 October   2024 SN75LVPE3101

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Switching Characteristics
    8.     14
    9. 5.8 Typical Characteristics
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 4-Level Control Inputs
      2. 6.3.2 Linear Equalization
      3. 6.3.3 PCIe/SATA/SATA Express Redriver Operation
    4. 6.4 Device Functional Modes
      1. 6.4.1 Shutdown Mode
      2. 6.4.2 Disconnect Mode
      3. 6.4.3 Active Mode
  8. Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical SATA, PCIe and SATA Express Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Thermal Information

THERMAL METRIC(1) SN75LVPE3101 UNIT
RGE (VQFN)
24 PINS
RθJA Junction-to-ambient thermal resistance 38.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 41.6 °C/W
RθJB Junction-to-board thermal resistance 16.3 °C/W
ΨJT Junction-to-top characterization parameter 1.0 °C/W
ΨJB Junction-to-board characterization parameter 16.4 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 6.9 °C/W
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.