SLLSG10 November   2024 TDP142-Q1

ADVANCE INFORMATION  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Power Supply Characteristics
    6. 5.6 Control I/O DC Electrical Characteristics
    7. 5.7 DP Electrical Characteristics
    8. 5.8 Switching Characteristics
    9. 5.9 Typical Characteristics
  7.   Parameter Measurement Information
  8. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 DisplayPort
      2. 6.3.2 Configuration Jumper Levels
      3. 6.3.3 Receiver Linear Equalization
    4. 6.4 Device Functional Modes
      1. 6.4.1 Device Configuration in GPIO Mode
      2. 6.4.2 Device Configuration in I2C Mode
      3. 6.4.3 Linear EQ Configuration
      4. 6.4.4 Operation Timing – Power Up
    5. 6.5 Programming
  9. Register Maps
    1. 7.1 TDP142-Q1 Registers
  10. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 ESD Protection
    2. 8.2 Typical Application
      1. 8.2.1 Source Application Implementation
        1. 8.2.1.1 Design Requirement
        2. 8.2.1.2 Detail Design Procedure
      2. 8.2.2 Sink Application Implementation
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  11. Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  12. 10Revision History
  13. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Tape and Reel Information
    2. 11.2 Mechanical Data

Detail Design Procedure

Designing in the TDP142-Q1 requires the following:

  • Determine the loss profile on the DisplayPort input (A) and output (B) channels. See Figure 8-5 for 6mil trace insertion loss.
  • Based upon the loss profile, determine the optimal configuration for the TDP142-Q1, to pass electrical compliance. DPEQ[1:0] must be set to appropriate value. For this case, 12 inches of FR4 trace approximately equates to 8dB loss at 4.05GHz. Therefore, tie DPEQ1 20kΩ to ground and DPEQ0 1kΩ to ground.
  • See Figure 8-3 for information on the source application that uses AC-coupling capacitors, control pin resistors, and the recommended decouple capacitors from VCC pins to ground.
    • AUX: Make sure the AUXP has a 100kΩ pulldown resistor and the AUXN has a 100kΩ pullup resistor. These 100kΩ resistors must be on the TDP142-Q1 side of the 100nF capacitors.
    • HPDIN is used to enable or disable DisplayPort functionality for power saving. Route the HPD signal to either pin 23 or pin 32 based on the GPIO/I2C mode.
      Table 8-4 HPD GPIO/I2C Selection
      MODEHPD
      GPIO (I2C_EN = 0)Pin 32
      I2C (I2C_EN != 0)Pin 23

    • For the application supporting Dual mode DisplayPort: SNOOPENZ pin must be connected to the CONFIG1 on DisplayPort Receptacle through a buffer like the SN74AHC125. The buffer is needed because the internal pulldown on SNOOPENZ pin is too strong to register a valid VIH when a Dual mode adapter is plugged into the DisplayPort receptacle.
  • Configure the TDP142-Q1 using the GPIO terminals or the I2C interface:
    • GPIO – Using the terminals DPEQ0 and DPEQ1.
    • I2C – Refer to the I2C Register Maps and the Programming section for a detail configuration procedures.
  • The thermal pad must be connected to ground.