SLLU149E
June 2011 – February 2016
TUSB7320
,
TUSB7340
TUSB73x0 Board Design and Layout Guidelines
Trademarks
Related Documentation
1
Typical System Implementation
1.1
Overview
2
Power
2.1
Overview
2.2
Digital Supplies
2.3
Analog Supplies
2.4
Ground Terminal
2.5
Capacitor Selection Recommendations
2.6
USB VBUS
3
Device Reset
3.1
Overview
4
General High Speed Layout Guidelines
4.1
Printed Circuit Board Stackup (FR-4 Example)
4.2
Return Current and Plane References
4.3
Split Planes – What to Avoid
4.4
Avoiding Crosstalk
5
USB Connection
5.1
Overview
5.2
Internal Chip Trace Length Mismatch
5.3
High-Speed Differential Routing
5.4
SuperSpeed Differential Routing
6
Package and Breakout
6.1
Package Drawing
6.2
Routing Between Pads
6.3
Pads
6.4
Land Pattern Recommendation
6.5
Solder Stencil
7
PCI Express Connection
7.1
Internal Chip Trace Length Mismatch
7.2
Transmit and Receive Links
7.3
PCI-Express Reference Clock Input
7.4
PCI Express Reset
7.5
PCI Express WAKE/CLKREQ
7.5.1
Leakage Current on Pins WAKE# and CLKREQ#
7.5.2
Recommendations
8
Wake from S3
8.1
Overview
9
Device Input Clock
9.1
Overview
10
JTAG Interface
10.1
Overview
11
Differential Pair ESD Protection
11.1
Overview
12
SuperSpeed Redriver
12.1
Overview
13
SMI Pin Implementation
13.1
Overview
14
Schematics
14.1
Overview
14.2
TUSB7320 DEMO EVM REVB Schematics
14.3
TUSB7340 DEMO EVM REVB Schematics
Revision History
5
USB Connection