SLLU339 July   2021 ISOW7740 , ISOW7741 , ISOW7742 , ISOW7743 , ISOW7744

 

  1.   Trademarks
  2. 1Introduction
  3. 2Overview
  4. 3Pin Configurations of the ISOW7841 and ISOW7741
  5. 4EVM Setup and Operation
  6. 5EVM Schematic
  7. 6PCB Layout and 3D Diagram
  8. 7Bill of Materials

4 EVM Setup and Operation

This section describes the typical test setup and operation of the EVM for device evaluation. Figure 4-1 shows how the ISOW-ADAPTOR-EVM can be mounted onto a PCB with ISOW784x footprint. The headers J3 and J4 are located under the PCB, hence, it might not be convenient to solder the whole PCB onto ISOW784x footprint as-is. Therefore, it is suggested that headers J3 and J4 are unplugged from J1 and J2 first, then J3 and J4 be soldered onto ISOW784x footprint after estimating their approximate positions and then hearders J1 and J2 be plugged onto J3 and J4, respectively. If needed, headers J3 and J4 can also be slightly bent to adjust the positions making it convenient to mount J1 and J2 as needed. Figure 4-2 shows a photograph of actual PCB side view highlighting J3 and J4 leads.

GUID-20210712-CA0I-BMLB-FZPW-MMGNQQTSJPX7-low.png Figure 4-1 ISOW-ADAPTOR-EVM Connection Diagram
GUID-20210712-CA0I-VWBJ-7SMV-CJ49S91FPXL5-low.png Figure 4-2 ISOW-ADAPTOR-EVM Side View