SLLU386
August 2024
TIOL221
1
Description
Features
Applications
5
1
Evaluation Module Overview
1.1
Introduction
1.2
Kit Contents
1.3
Specification
1.4
Device Information
2
Hardware
2.1
Power Requirements
2.2
Current Limit Configuration
2.3
Setup
2.4
Header Information
2.5
Jumper Information
2.6
IO-Link Interface
2.7
Test Points
2.8
I2C EEPROM
3
Software
4
Hardware Design Files
4.1
Schematics
4.2
PCB Layouts
4.3
Bill of Materials (BOM)
5
Additional Information
5.1
Trademarks
4.2
PCB Layouts
Figure 4-2
Top Overlay
Figure 4-4
Top Solder Mask
Figure 4-6
Top Layer
Figure 4-8
Layer 2 GND
Figure 4-10
Drill Drawing
Figure 4-3
Bottom Overlay
Figure 4-5
Bottom Solder Mask
Figure 4-7
Bottom Layer
Figure 4-9
Layer 3 PWR
Figure 4-11
Board Dimensions