SLLU386 August   2024 TIOL221

 

  1.   1
  2.   Description
  3.   Features
  4.   Applications
  5.   5
  6. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  7. 2Hardware
    1. 2.1 Power Requirements
    2. 2.2 Current Limit Configuration
    3. 2.3 Setup
    4. 2.4 Header Information
    5. 2.5 Jumper Information
    6. 2.6 IO-Link Interface
    7. 2.7 Test Points
    8. 2.8 I2C EEPROM
  8. 3Software
  9. 4Hardware Design Files
    1. 4.1 Schematics
    2. 4.2 PCB Layouts
    3. 4.3 Bill of Materials (BOM)
  10. 5Additional Information
    1. 5.1 Trademarks

PCB Layouts

TIOL221EVM Top OverlayFigure 4-2 Top Overlay
TIOL221EVM Top Solder MaskFigure 4-4 Top Solder Mask
TIOL221EVM Top LayerFigure 4-6 Top Layer
TIOL221EVM Layer 2 GNDFigure 4-8 Layer 2 GND
TIOL221EVM Drill DrawingFigure 4-10 Drill Drawing
TIOL221EVM Bottom OverlayFigure 4-3 Bottom Overlay
TIOL221EVM Bottom Solder MaskFigure 4-5 Bottom Solder Mask
TIOL221EVM Bottom LayerFigure 4-7 Bottom Layer
TIOL221EVM Layer 3 PWRFigure 4-9 Layer 3 PWR
TIOL221EVM Board DimensionsFigure 4-11 Board Dimensions